The Winter Games are over and the athletes returned home, and the SEMICON Korea 2018 teams from February have their sights on SEMICON China this month after all that snow-in-Seoul settled, but I still have a few more comments about the Electropackage System and Interconnect Product technical session SEMI organized for the afternoon of 01 February 2018, and on which I reported in my first installme... »
We are pleased to announce the winners of the 2018 3D InCites Awards, sponsored by KLA-Tencor and EV Group and hosted by iMAPS. This may have been the most exciting awards year yet, with 40 nominees from 26 companies and four research institutes competing for awards in 9 categories. The competition was fierce! We logged in over 40,619 online votes, more than twice the number of last years event. T... »
Semiconductor device fabrication and packaging is rife with acronyms, and by my estimate, the Top 3 trafficked by speakers at the recent IMAPS Device Packaging Conference were the acronyms FOWLP, FOPLP, and MEMS. That would be fan-out wafer level packaging, fan-out panel level packaging, and microelectromechanical systems, respectively. It wasn’t that IMAPS was a MEMS packaging conference in the... »
In the fourth installment of the series “Convergence on the Big Five,” we compared conventional SiP with advanced system-in-package (SiP), which is focused on laminate-based approaches, and is available and in production today. Advanced SiP packaging has been a game changer in addressing system-level integration and providing the lowest form factor at cost and performance points that address m... »
Part four in a five-part series While many industry experts have long predicted the demise of Moore’s law, it’s only in the past few months that it seems we have exhausted current CMOS scaling methods. While it’s likely that scaling approaches will resume in the future as new materials, processes, and tools are developed, the reality is that these solutions are still in the early stages of d... »
TEMPE, Ariz., June 28, 2016 – Driven by the increase in global demand for sensors from the smartphone and automotive markets, Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced it is ramping up a new MEMS and sensor packaging line at its facility in Shanghai. This new, state-of-the-art line will build on the expertise developed... »
Part three of a five-part series In the first two parts of this series, we focused on low-cost flip chip and wafer-level chip scale packages (WLCSP), identifying them as two advanced packaging platforms we consider to be among the “Big Five.” It is our belief at Amkor that convergence into these five platforms is driven by the shift away from PCs and notebooks, toward mobile devices, wearables... »
Part two of a five-part series. How did we determine which technologies are “the Big Five,” for semiconductor packaging? Essentially, we identified the five key platforms that we believe will be leveraged across a multitude of applications and markets now and in the future. The selected platforms are low-cost flip chip, wafer-level chip scale packaging (WLCSP), micro-electromechanical systems... »
Part one of a five-part series. Over the past few years, there has been a significant shift from PCs and notebooks to smartphones and tablets as drivers of advanced packaging innovation. In an industry segment that has grown accustomed to a multitude of package varieties, we believe we are now headed for convergence into what Amkor calls “The Big Five” advanced packaging platforms. These inc... »
Collected impressions of 2016 to date: the unfortunate passing of too, too many favorite musicians; the hard-to-escape-from strident bellicosity of our national political campaigns; a winter of welcome, abundant, Northern California rains; along with a plethora of riches in the Silicon Valley conference, symposium, and seminar vein. Take the January 2016 Johnson School Dinner at the Rosewood Hotel... »
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