Happy Holidays! Here’s the last of our community news round-up for 2022. Can’t wait to see what’s in store for the New Year.
Siemens Digital Industries Software announced that its Sokol™ Flex OS software now supports RISC-V embedded development with the availability of one of the industry’s first commercially supported, extensible, and customizable Linux® platforms for the RISC-V architecture. Based on the popular, open-source Yocto Project industry standard, Siemens‘ Sokol Flex OS helps embedded developers create customized, Linux-based systems for RISC-V architectures with ease, security, and confidence. The RISC-V architecture is ideally suited for industrial, medical, defense-aerospace, and consumer applications.
TEL launched CELLESTA™ MS2, a system for surface preparation and wafer cleaning. The new CELLESTA MS2 incorporates a physical cleaning function featuring dual-fluid spray technology and brushes. Its capability to process both wafer sides simultaneously significantly boosts the system’s productivity per unit area, making it over 1.5 times more productive than TEL’s existing systems when both wafer sides need to be cleaned.
KLA introduced the Axion® T2000 X-ray metrology system for advanced memory chip manufacturers. The Axion T2000 features patented technologies that power its ability to measure high aspect ratio device features with an unprecedented combination of resolution, accuracy, precision, and speed.
Amkor Technology introduced its new in-house tester, the AMT4000. This tester can test OS/DC (ISVM, VSIM, and resistance measure) and offers advanced options such as a socket and reliability tester, probe card checker, and a capacitance measure unit. Amkor’s AMT4000 offers up to a 40% reduction in test costs and product time to market for its customers.
Evatec’s Product Marketing Manager, Roland Rittenmeier, attended the EPTC IEEE in Singapore discussing the latest technology developments in advanced packaging.
TechSearch International published its latest Advanced Packaging Update examining thermal challenges, EV charging, and providing an update on the build-up substrate supply and demand in the 72-page report. TechSearch International’s latest analysis describes thermal challenges facing the industry from mobile to high-performance computing. With increased power dissipation, companies are moving to higher-performance thermal interface materials and adopting new cooling methods including liquid immersion. The report discusses these developments and describes thermal interface material offered by suppliers.
The 2023 IMAPS Device Packaging Conference registration is now open. IMAPS published its new technical program which includes three Technical Tracks on Heterogeneous 2D & 3D Integration; Fan-Out, Wafer Level Packaging & Flip Chip; Next-Gen Applications (Automotive, 5G/6G, Photonics, HiSpeed RF).
Ajinomoto Co., Inc. hosted a sponsored symposium on Dec. 9 at the 22nd Annual International Congress of Nutrition (ICN), sharing the Group’s nutritional commitments.
On December 7th, Veeco’s Bill Miller, John Kiernan, and Anthony Bencivenga joined the Barclays Global Technology, Media, and Telecommunications Conference as panelists to discuss the semiconductor market, 2023 predictions for memory and data storage, and more.
SEMI Europe and European Commission representatives proposed key actions to overcome the skills shortage in Europe’s microelectronics industry. The actions resulted from a December 2 workshop held in Brussels to support the European Chips Act and address challenges and future opportunities for developing skills critical to Europe’s semiconductor ecosystem.
SurplusGlobal held a ribbon-cutting ceremony to celebrate the completion of the Semiconductor Equipment Cluster at its headquarters office in Yongin-si.
Taro Fujie, President and Chief Executive Officer (CEO) of Ajinomoto Co., Inc., recently presented the Ajinomoto Group’s progress report and remaining initiatives for enhancing corporate value before the end of FY2022, which ends on March 31, 2023. Going forward into 2030, the Ajinomoto Group has recognized four future growth areas as its priorities. These four areas include healthcare, food and wellness, ICT, and green.
ASE VP Steve Fang, who together with Clifford Sandstrom, Tim Olson of Deca Technologies, and Jeffery Yang won the best paper on M-series descaling and adaptive patterning at the 24th Electronics Packaging Technology Conference 2022.
SEMI President and CEO Ajit Manocha and SEMI Japan President Jim Hamajima were honored to host Japanese Prime Minister Fumio Kishida at SEMICON Japan 2022. Speakers and exhibitors presented the latest innovations in semiconductor manufacturing, AI, IoT, robotics, MedTech, green energy, quantum computing, and more.
Onto Innovation; Various Openings