Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth sharing from the month previous. If we missed you this month, be sure to add us to your distribution list, we don’t want to leave anyone out. Our community members are active industry participants and it’s our goal to share all that we can.

KLA will build a new research-and-development (R&D) and manufacturing center for its SPTS Division, in Newport, Wales, UK. The new development designed to meet BREEAM standard of sustainability rating of excellent is expected to include a capital investment of more than $100 million and create a 200,000 square foot innovation center and manufacturing facility, accommodating up to 750 employees.

Roland Rettenmeier, Senior Manager Product Marketing BU Advanced Packaging at Evatec AG delivered a presentation on advanced Ti+Cu seed sputter technologies for glass substrates with through glass via and through glass cavities as well as low-k polymer laminated glass substrates at the International Semiconductor Executive Summits Taiwan on October 11-12. Evatec has carried out extensive research together with Institutes and Cooperation partners on new materials and process developments along with their optimization on glass substrates as a viable low cost technology for next generation IC-Substrates and large interposers.

Evatec CEO Andreas Waelti was awarded Entrepreneur of the Year 2022 in Switzerland in the category “Industry, High Tech and Life Sciences” at a ceremony in Zurich hosted by Ernst & Young.

Smoltek was awarded a new patent in Japan. This patent is the sixth one of the patent family in the direction of CNF-MIM based compact energy storage on interposers, bringing Smoltek’s global patent portfolio to a total of 77 granted patents.

Cadence unveiled the new Cadence Certus Closure Solution to address growing chip-level design size and complexity challenges. The Cadence Certus Closure Solution automates and accelerates the complete design closure cycle from weeks to overnight, supporting the largest chip design projects with unlimited capacity while improving productivity by up to 10X.

Siemens Digital Industries Software announced the latest release of Solid Edge software for product design, engineering and manufacturing, bringing a new streamlined user experience, greater interoperability with the Siemens Xcelerator portfolio and greater capability and collaboration across many industry workflows.

QP Technologies expanded its process capabilities to meet increasing demand for packaging and assembly, including wafer preparation and substrate design and development.

3D InCites community members, Brewer Science, KLA, Lam Research and TEL, were among more than 60 companies that joined SEMI’s Semiconductor Climate Consortium (SCC) as founding members. Consortium aims to accelerate reduction of greenhouse gas emissions across semiconductor value chain.

Cadence announced that TSMC has certified the Cadence digital and custom/analog design flows for the latest TSMC N4P and N3E processes in support of the new Design Rule Manual (DRM) and FINFLEX technology.

International Semiconductor Executive Summits Taiwan 2022 hosted a Gala Dinner sponsored by Onto Innovation where Dr Monita Pau, Director Strategic Marketing, Advanced Packaging delivered a talk addressing Process Control Challenges in Chiplet Integration.

Adam Scotch of Brewer Science presented at TechBlick last month. His presentation demonstrated how to design, build, and deploy connected gas and water sensors that monitor environmental contaminants on a large scale. This life-saving technology is the future of water monitoring capabilities.

Mercury Systems was at AOC2022 talking about its newly released mPOD EA training system with proven technology for electronic warfare training, test and evaluation.

Global EVG Sales and Technology teams got together at an idyllic location in upper Austria to kick off the new business year with the post-COVID continuation of the annual “Sales & Technology Summit.”

ERS Electronic participated at SWTest Asia this year, presenting a paper on High Wattage Dissipation Under Temperature – a new method for test evaluation.

Terry Tsao, SEMI Global Chief Marketing Officer and SEMI Taiwan President, received the Events Industry Council 2022 Global Award for Adaptation and Innovation. Terry has been a key force behind the 60 percent growth in attendance at SEMICON Taiwan over the past 10 years.

Jan Vardaman of TechSearch International presented at the IMPACT 2022 conference in Taipei City, Taiwan, where she discussed the drivers and challenges for next-generation packaging, touching on the topics on performance, time-to-market, and sustainability.

Hiring

NHANCED Semi https://nhanced-semi.com/design-engineer-job-openings/

 

Trine Pierik

Trine Pierik is the 3D InCites community membership director. She is responsible and committed to…

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