Latest Posts
October Member News: Shaping a Smarter, More Connected Semiconductor Future
October proved to be a dynamic month across the semiconductor and advanced packaging ecosystem, marked by innovation, expansion, and global...
September Member News: Innovation and Collaboration
The month of September saw continued momentum in the semiconductor industry, highlighted by exciting industry events, innovative technology launches, and...
August Member News: Pivotal Shifts in Leadership, Investments and Innovation
The month of August held pivotal shifts in the semiconductor industry, marked by leadership transitions, targeted investments, and continued innovation...
February Member News: Expansion, Collaborations, and Events Galore
February member news shows dynamic activity for semiconductor industry, with exciting advancements in technology, strategic expansions, key industry events, and...
Announcing the Winners of the 2025 3D InCites Awards
As advanced interconnect and advanced packaging processes take the helm to drive advancements in next generation semiconductor devices, innovation and...
3D Integration Themes Become a Reality at IEDM 2024
The Transistor Wars are back, but they look a little different this time. I’ve been attending the IEDM conference off...
Interconnectology Saves the World!
In 2007, when I was managing editor at the now defunct Advanced Packaging Magazine, we went out on a limb...
October 2024 Member News
October 2024 member news was marked by significant developments and milestones. From the grand openings of cutting-edge facilities that enhance...
IFTLE 609: TSMC/Amkor U.S. Advanced Packaging Partnership; Reshoring at IMAPS 2024
TSMC/Amkor agreement Will Put U.S. Advanced Packaging on The Map TSMC has signed a memorandum of understanding (MoU) with Amkor...
Community Member Highlights for September 2024
As summer holidays came to a close, September found our member companies ramping up new products and opening new facilities....
ASU’s SWAP Hub and National Collaborations Shape U.S. Microelectronics Leadership
In August of 2023, I attended the inaugural meeting of the Southwest Advanced Prototyping (SWAP) Hub, spearheaded by the Ira...
Witnessing Foundry 2.0 in Action
One of the ways I learn about advanced packaging technology and what it entails is by visiting our community member...
June Member News Highlights Semiconductor Design Tools, Collaborations, and More
This June, we’ve seen exciting strides in AI for semiconductor design, showcasing how AI and Digital Twin technologies are revolutionizing...
May Member News: Strategic Moves, Product Launches, Sustainability and more
May member news showcases significant strides in advancing semiconductor technologies and fostering sustainability efforts. From strategic divestitures and innovative product...
Announcing the Winners of the 2024 3D InCites Awards
It was an interesting year for the 2024 3D InCites Awards as we changed our processes, criteria, and categories to...
January Member Achievements, New Hires and Grand Openings
Members of the 3D InCites community hit the year running by celebrating milestones, new hires, promotions, and grand openings. Here...
Will a New Advanced Packaging Foundry Model Extend Moore’s Law?
Challenges to 3DHI and chiplets remain, but new advanced packaging foundry solutions are stacking up The industry consensus is that...
IFTLE 567: IMAPS Onshoring Conference Reports U.S. OSAT Activities
Continuing our look at the IMAPS Onshoring conference with a look at U.S. OSAT activities. (We should note that while...
