Yann Guillou, Author at 3D InCites

3D InCites Turns 10: A Brief Analysis of the 3D Journey

3D InCites Turns 10: A Brief Analysis of the 3D Journey

I cannot believe 3D InCites is already turning 10! As wise people say, time flies!  Taking a step back, I have to admit a lot of progress has been made since my first attendance as a young engineer to the EMC 3D workshops back in 2008. At that time, we were discussing how to form a via, how to fill it, how to use a temporary wafer carrier to process thin wafers…etc. We are definitely more m... »

3D IC Test

3D TSV without Limits

What can we expect out of 2.5 and 3D TSV Integration? What are the three leading-edge R&D institutes in 2.5 and 3D TSV investigating? On November 18, SEMI offered a webinar entitled “3D TSV without Limits.” Francoise von Trapp of 3D InCites moderated the webinar which featured Eric Beyne, director of 3D System Integration program at imec, Herve Ribot, head of 3D at CEA-LETI and Juergen Wol... »