Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq:TSRA), announced that Tong Hsing Electronic Industries Ltd., a leading Taiwanese provider of microelectronic packaging and substrate manufacturing services, has entered into a license agreement for Invensas’ Bond Via Array™ (BVA®) vertical interconnect technology. In addition, the companies have completed technology transfer and qualification of the BVA platform.
The increasing functionality of smartphones, wearables and Internet of Things (IoT) devices is driving a requirement for low cost, small form-factor micro-electromechanical systems (MEMS) devices and system-in-package (SiP) solutions. BVA readily addresses this market requirement by leveraging existing manufacturing infrastructure and eliminating the need for expensive interconnect processes such as laser drilling, copper plating or through silicon vias (TSVs).
“Cost effective and robust vertical interconnect technology is critically important for the miniaturization of next generation electronics,” said Craig Mitchell, President of Invensas. “We are pleased with our collaboration with Tong Hsing to commercialize BVA technology to meet this market need and look forward to continuing our partnership.”
“It has been a great pleasure to work with Invensas team to evaluate and qualify the BVA technology platform,” said Heinz Ru, President of Tong Hsing. “We look forward to providing BVA packaging services to the MEMS industry.”