IoT

2018 Industry Outlook: It’s Time to Get Serious about 5G

2018 Industry Outlook: It’s Time to Get Serious about 5G

While the entire semiconductor industry is buzzing about explosive and sustained growth well into the 2020s driven by smart everything (homes, cities, industry), automotive electronics, artificial intelligence and more, what’s truly exciting is how we are going to support the connectivity of all those applications. 5G is where it all comes together. Without it, connecting all this disparate data... »

imec and Analog Devices Sign Strategic Research Partnership for Development of Next-Generation IoT Devices

imec and Analog Devices Sign Strategic Research Partnership for Development of Next-Generation IoT Devices

LEUVEN, Belgium, and NORWOOD, MA —October 12, 2017—Imec, the world-leading research and innovation hub in nanoelectronics and digital technologies and Analog Devices, Inc. (ADI), the leading global high-performance analog technology company, today announced they have entered into a strategic research partnership to develop the next generation of Internet of Things (IoT) devices. With two initi... »

EMD Performance Materials Announces Comprehensive Materials Solutions for Chip Miniaturization and Smart Packaging

EMD Performance Materials Announces Comprehensive Materials Solutions for Chip Miniaturization and Smart Packaging

  Philadelphia PA, USA, July 10, 2017 – EMD Performance Materials, a leading science, and technology company, today announced its portfolio of materials solutions for advanced semiconductor manufacturing. Megatrends represented by big data, automotive electronics, IoT, and an increased interest in green assembly, is expanding the need for advanced semiconductor processing and novel materi... »

Heterogeneous Integration Makes an End Run Around 7nm Silicon at SEMI ASMC 2017

Heterogeneous Integration Makes an End Run Around 7nm Silicon at SEMI ASMC 2017

I like to think that someday soon a perfectly ripe tomato growing on a vine is going to signal its condition via the 5G network to an AI who knows I love heirloom tomatoes at their peak; my AI will place an order for me based on standing instructions (after first confirming I am indeed expected home that evening, and that I already don’t have too many heirlooms on the counter), and an autonomous... »

drone technology

Executive Viewpoint: Next-Gen Drone Technologies Rely on Semiconductor Innovation

Robotics and drone technologies are one of the fastest growing end-use markets for integrated sensor technology today. According to a 2016 Yole Développement market report, the 2015 $351M US sensor market for drones and robots is expected to double by 2021, reaching US$ 709 million at a 12.4% CAGR. Key technologies include 3D cameras, solid state light detection and ranging (LIDAR), and ultra-pre... »

IWLPC 2016 Keynotes Look to A Connected Future Enabled by Advanced Packaging

IWLPC 2016 Keynotes Look to A Connected Future Enabled by Advanced Packaging

The 2016 International Wafer-Level Packaging Conference (IWLPC), which took place October 18-20, 2016 in San Jose, CA, focused on a theme of “Bridging the Interconnect Gap”, as the industry faces new challenges due to the onslaught of Big Data brought about by the Internet of Things (IoT). To provide vision on how best to address these challenges using advanced packaging technologies, the IWLP... »

More Food for Thought From The 2016 European MEMS Summit

More Food for Thought From The 2016 European MEMS Summit

Granted, while there may not have been a single “aha!” moment at the 2016 European MEMS Summit, held September 15-16 in Stuttgart Germany, the speakers did provide interesting food for thought as they talked about their companies’ activities and offerings in MEMS and sensor technology. 2016 European MEMS Summit from 3D InCites on Vimeo. In addition to the summary I posted earlier this week,... »

European MEMS Summit 2016: Are MEMS Manufacturers Richer than Last Year?

European MEMS Summit 2016: Are MEMS Manufacturers Richer than Last Year?

After the European MEMS Summit 2016 concluded on Friday afternoon (September 15-16, 2016), one of the attendees asked me which presentation was  my favorite presentation. I mulled it over, first declaring it was the Intel presentation by Raji Baskaran, and then Jérémie Bouchaud’s (IHS) presentation. And then it hit me: in all honesty, my favorite presentation was the closing remarks, deli... »

Making Connections at SEMICON West 2016

Making Connections at SEMICON West 2016

If you attended SEMICON West 2016 last week, you probably noticed that the event is undergoing a metamorphosis. It was hard to miss. The signs were everywhere. Literally: It’s not surprising, since everything about the semiconductor manufacturing industry has been evolving over the past few years, and everyone, including SEMI, is feeling the impact. As Karen Savala, President, SEMI Americas, exp... »

3D InCites Guide to SEMICON WEST 2016

3D InCites Guide to SEMICON WEST 2016

In past years, we have provided 3D InCites readers with a guide for navigating through the myriad programs that specifically address 3D integration and packaging at SEMICON West. This year, as SEMI has discovered, everything has changed; and thus they themed SEMICON West 2016, “Definitely NOT business a usual.” As an industry, we have moved far beyond the point of industry segments working... »

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