Before becoming CEO in August of 2020, Rama Alapati spent two years as a YES technology advisory board member, and he has been YES’s chairman since January of 2020. Prior to that, he oversaw engineering and operations at PsiQuantum, led technology strategy and roadmaps at Amkor Technology, directed packaging product management and R&D at GlobalFoundries, and guided the development and commercialization of double patterning & TSV technologies at Micron Technology. Mr. Alapati has a master’s degree in chemical engineering from the University of Kansas, a bachelor’s degree in chemical engineering from Osmania University in India, and executive education from Harvard. He holds over 30 patents.
Convergence on the “Big Five”: Focus on Wafer-based Advanced SiP
Jul 08, 2016 · By Rama Alapati · BlogsIn the fourth installment of the series “Convergence on the Big Five,” we compared conventional SiP with advanced system-in-package (SiP),...
Convergence on the “Big Five”: Focus on Laminate-based Advanced SiP
Jun 30, 2016 · By Rama Alapati · BlogsPart four in a five-part series While many industry experts have long predicted the demise of Moore’s law, it’s only...