MEMS

Arizona SEMI Breakfast Forum Focuses on Sensors Enabling a Connected World

Arizona SEMI Breakfast Forum Focuses on Sensors Enabling a Connected World

Why are sensors not on the same growth trajectory as CMOS? In the face of a shaky global economy, where are the opportunities coming from? How will doctors practice medicine five years from now and how will MEMS and sensors be involved? What are some of the cool, upcoming sensor-enabled devices that will change how we interact with the world? These questions and more were the topics of discussion ... »

Talking Nerdy with Exhibitors at IWLPC 2018

Talking Nerdy with Exhibitors at IWLPC 2018

With heterogeneous integration, 3D, and advanced wafer-level packaging technologies officially declared the rising stars of the semiconductor industry, materials, process and equipment suppliers have pulled out their shiniest bells and whistles. Here’s a sampling of news and products that were on display at IWLCP 2018, October 23-25, 2018 at the Doubletree Hotel in San Jose. Indium Corporation... »

Tips for Navigating the European MEMS and Sensors/Imaging and Sensors Summits

Tips for Navigating the European MEMS and Sensors/Imaging and Sensors Summits

For the second consecutive year, SEMI Europe is co-locating its MEMS and Sensors/Imaging and Sensors Summits in Grenoble, France, in the heart of the Rhone-Alpes. Rather than Minatec Campus, where the event was held last year, both summits will take place at The World Trade Center Grenoble. After last year’s successful and information-packed event, I’m looking forward to attending this year’... »

How Jessica Gomez Short-Circuited Her Way to CEO: A SemiSister Success Story

How Jessica Gomez Short-Circuited Her Way to CEO: A SemiSister Success Story

The number is sobering: according to the U.S. Bureau of Labor of Statistics, 16.9% of chemical engineers and 12.3% of electrical/electronics engineers in the US are women. For racial diversity, the situation is even worse. These grave statistics came to light during a recent panel discussion during SEMICON West, in its Workforce Pavilion. Here, Jessica Gomez, co-founder and CEO of Rogue Valley Mic... »

Packaging, Innovation, and Our Application-Driven World

Packaging, Innovation, and Our Application-Driven World

MEPTEC lunches, now known as the MEPTEC / IMAPS / SEMI Semiconductor Speaker Series Luncheon sponsored by Chip Scale Review, are on again in Silicon Valley. At the most recent lunch  in mid-March 2018, I was pleased to see that it was none other than Rich Rice, VP Business Development, ASE US, delivering his view on Packaging Innovation for our Application-Driven World Rich’s thesis: that, desp... »

Technical Tidbits from IWLPC and MSEC 2017

Technical Tidbits from IWLPC and MSEC 2017

It’s been a busy few weeks for me as I attended both the International Wafer Level Packaging Conference (IWLPC), October 24-26, 2017 at the DoubleTree in San Jose and SEMI-MSIG’s MEMS and Sensors Executive Congress, October 31-Nov. 2, at the Hayes Mansion in San Jose. In addition to taking in some great keynotes and technical sessions, I had the opportunity to meet with several companies to fi... »

Dinner Conversation at the MEMS and Sensors Executive Congress (MSEC17)

Dinner Conversation at the MEMS and Sensors Executive Congress (MSEC17)

One of the things I like best about the annual MEMS and Sensors Executive Congress (MSEC17) hosted by SEMI-MSIG, is being in the presence of some of the greatest minds in the industry. While the presentations are always top-notch, it’s the stimulating dinner conversations they inspire that I look forward to most. This year, I decided to leave the straightforward reporting to my journalist collea... »

Technology Showcase Finalists Revealed for European MEMS & Sensors Summit

Technology Showcase Finalists Revealed for European MEMS & Sensors Summit

GRENOBLE, France ─ August 28, 2017 – SEMI®, with its Strategic Association partner MEMS & Sensors Industry Group® (MSIG), today announced its shortlist of competitors for the Technology Showcase, which will take place on September 21 at the SEMI European MEMS & Sensors Summit 2017 in Grenoble. Selected by a committee of industry experts, five finalist companies will demonstrate advan... »

EV Group Optimizes Resist and Lithographic Processing for Plasma Dicing for Advanced Semiconductor Packaging Applications

EV Group Optimizes Resist and Lithographic Processing for Plasma Dicing for Advanced Semiconductor Packaging Applications

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it is demonstrating optimized pre-processing solutions for the implementation of plasma dicing for advanced semiconductor packaging applications. EVG’s latest products and process development services support this emerging semiconductor back-end fa... »

EV Group Expands Production Capacity at Corporate Headquarters in Austria

EV Group Expands Production Capacity at Corporate Headquarters in Austria

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is expanding production capacity at its corporate headquarters in St. Florian am Inn, Austria. Representing a 20 million Euro investment, the expansion will include the construction of a new building that provides additional production and te... »

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