Latest Posts - Page 2
MEMS & Sensors Industry Group Reveals Tech Showcase Finalists
MEMS & Sensors Industry Group (MSIG)’s annual MEMS & Sensors Technology Showcase at MEMS & Sensors Executive Congress® 2016 (November...
3D TSVs are essential for Heterogeneous Integration, HPC and High-end Memory
This year again, both market segments, high end, and low end, are the main targets of through silicon via (TSV)...Fraunhofer EMFT Signs Agreement to Implement ZiBond and DBI Technologies in MEMS Applications
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc., (Nasdaq: TSRA) has announced that Fraunhofer EMFT has signed a...
More Food for Thought From The 2016 European MEMS Summit
Granted, while there may not have been a single “aha!” moment at the 2016 European MEMS Summit, held September 15-16 in...
MEMS and Sensors Industry Group Becomes Part of SEMI
Peter Clarke, EE Times, and I both agree – the biggest news of this year’s SEMI MEMS Summit, which took...
Leading Market Analysts to Explore Future of MEMS at the European MEMS Summit
The second annual European MEMS Summit takes place in Stuttgart, Germany, on September 15-16, 2016. In addition to top MEMS technologists, the...
EV Group Rolls Out Automated Metrology System for Advanced Packaging, MEMS and Photonics Manufacturing
FLORIAN, Austria, July 11, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology...
Make Every Market Smarter: An Interview with SEMI’s Yann Guillou on the European MEMS Summit
SEMI’s first edition of the European MEMS Summit, which took place in 2015 in Milan, was a stellar success, attracting...
Convergence on the “Big Five”: Focus on WLCSP
Part two of a five-part series. How did we determine which technologies are “the Big Five,” for semiconductor packaging? Essentially,...
2016 Illuminated: Same Bulb, Different Shades?
Collected impressions of 2016 to date: the unfortunate passing of too, too many favorite musicians; the hard-to-escape-from strident bellicosity of...
EV Group Technology Day Examines Photonics, Nanoimprint Lithography, 3D and MEMS
It’s been two years since I last visited EV Group headquarters in Schärding, Austria, so I was glad to be able...
SPTS sees a Brighter 2016
In contrast to some of the gloomier predictions of the analysts, we think 2016 will be a growth year for...
A Metallization Technology Whose Time Has Come
2015 was a year marked by through silicon via (TSV) productization for three memory applications and a push for more...
Perspective 2016: A Word On Things, From Before There Was An Internet
You can’t have the perpetual motion machine I received for Christmas this year, at least until I patent it. And...
The MEMS Supply Chain: Through the Looking Glass at IDTechEx 2015
What is the MEMS supply chain as we know it going to do, device makers and equipment suppliers both, if... Invensas Licenses BVA Vertical Interconnect Technology to Tong Hsing for MEMS Applications
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq:TSRA), announced that Tong Hsing Electronic Industries Ltd., a leading Taiwanese provider...
Cool Stuff at the MEMS Executive Congress 2015
Each year the MEMS Industry Group (heretofore known a the MEMs and Sensors Industry Group), turns the spotlight on some...
Hey Data Guys, Show Us the Money!
I spent last week attending two separate events: the opening of the Center for Heterogeneous Integration and Performance Scaling (CHIPS)...