Ron Huemoeller, Author at 3D InCites

Advanced Heterogeneous Packaging Solutions for High Performance Computing

Advanced Heterogeneous Packaging Solutions for High Performance Computing

Heterogeneous integrated circuit (IC) packaging has made a full entrance into the high-performance computing arena. The target applications are broad, running the gamut from artificial intelligence (AI), deep learning, data center networking, supercomputers, and autonomous driving. In fact, a new generation of deep learning AI, leading central processing units (CPUs) for data center servers as wel... »

Convergence on the “Big Five”: Focus on WLCSP

Convergence on the “Big Five”: Focus on WLCSP

Part two of a five-part series. How did we determine which technologies are “the Big Five,” for semiconductor packaging? Essentially, we identified the five key platforms that we believe will be leveraged across a multitude of applications and markets now and in the future. The selected platforms are low-cost flip chip, wafer-level chip scale packaging (WLCSP), micro-electromechanical systems... »

Convergence on the “Big Five”: Focus on Low-cost Flip Chip

Convergence on the “Big Five”: Focus on Low-cost Flip Chip

Part one of a five-part series.  Over the past few years, there has been a significant shift from PCs and notebooks to smartphones and tablets as drivers of advanced packaging innovation. In an industry segment that has grown accustomed to a multitude of package varieties, we believe we are now headed for convergence into what Amkor calls “The Big Five” advanced packaging platforms. These inc... »