MRSI Systems, Author at 3D InCites

MRSI Systems welcomes Hendry He as China Country Sales Director

MRSI Systems welcomes Hendry He as China Country Sales Director

MRSI Systems (Mycronic Group) is pleased to announce our new China Country Sales Director, Hendry He. He will be working alongside the existing sales team and representatives in the region and is based in Shanghai. His substantial technical experience selling semiconductor equipment along with his vast network in the Chinese market is guaranteed to even further enhance our responsiveness to our cu... »

MRSI to Present at 18th ICCSZ OC Market and Technology Seminar

MRSI to Present at 18th ICCSZ OC Market and Technology Seminar

MRSI Systems and CYCAD Century Science and Technology will partner together at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86. The show will be held at the Shenzhen Convention and Exhibition Center from September 4-7, 2019. MRSI Systems will also attend the 18th ICCSZ OC Market and Technology Seminar. This event is organized by... »

MRSI Improves Accuracy of MRSI-H/HVM-Series Die Bonders To to 1.5µm

MRSI Improves Accuracy of MRSI-H/HVM-Series Die Bonders To to 1.5µm

MRSI Systems (Mycronic Group) is pleased to announce the latest advancement in the MRSI-H/HVM-series line of die bonders. Placement accuracy was tested using industry-standard glass die reference samples. Results showed enhancement from ±3 µm at 3 sigma, to ±1.5 µm at 3 sigma. Moving forward for shipment starting from October 1, 2019, the product names will be MRSI-H and MRSI-HVM (formerly kno... »

MRSI Systems Welcomes Dr. Limin Zhou as Senior Director of Strategic Marketing

MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand MRSI’s market presence in China. He will be working alongside our existing sales team and representatives in the region. Dr. Zhou’s deep knowledge of the photonics market and his extensive network in the Chinese market will help drive MRSI’... »

MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China

MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China

STOCKHOLM, Nov 9, 2018 — MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district, Shenzhen, China. MRSI will be offering local demonstrations of its market-leading MRSI-HVM3 die bonder and also die bonding applications using customer’s sample materials, by arrangement. Thi... »

MRSI Systems Logo

MRSI’s MRSI-H3TO Die Bonding Product Family Supports the 5G Wireless Network Supply Chain

MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3μm high speed die bonder which will be the first of its kind to address the multi-die and multi-process requirements, delivering industry-leading throughput, superior flexibility, and future-proven 3μm placement accuracy. The MRSI-H3TO is tailored for WDM/EML-TO or other multi-die multi-processing TO-can photonic devices to support... »

MRSI Systems Logo

MRSI Targets MRSI-H3LD Die Bonder For The High Power Diode Laser Market

MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3μm high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced photonics such as industrial lasers, optical fiber amplification, lighting, and sensors. High power diode lasers are critical components for multiple markets and have seen a significant, continual rise in adoption with ... »

MRSI Systems Logo

MRSI Systems’ MRSI-HVM3P Extends The MRS-HVM3 Die Bonder Family to New Applications

BILLERICA, Massachusetts, USA, August 20, 2018 – MRSI Systems (Mycronic Group), is expanding its leading high-speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer configurations for active optical cable (AOC), gold-box packaging, and other applications in addition to chip-on-carrier (CoC). This expansion is in response to our customer’s request to take advantage of t... »

MRSI Systems’ New MRSI-HVM3 Die Bonder System Has Entered Volume Production

MRSI Systems’ New MRSI-HVM3 Die Bonder System Has Entered Volume Production

North Billerica, MA, March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that our new MRSI-HVM3 die bonder system has entered a volume production phase, using advanced Demand Flow Technology (DFT) to satisfy worldwide customer demand. Our ability to deliver the new product with short lea... »

MRSI Systems Demonstrates MRSI-HVM3 and Sponsors the 1st Laser Executive Forum at CIOE

MRSI Systems Demonstrates MRSI-HVM3 and Sponsors the 1st Laser Executive Forum at CIOE

North Billerica, MA, August 25, 2017 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems will be exhibiting at the 19th China International Optoelectronics Exposition (CIOE) at the Shenzhen Convention and Exhibition Center with our Chinese Representative CYCAD Century Science and Technology (Booth #1C66) in Shenzhen, Se... »

Page 1 of 212