Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality.
With extensive advanced packaging experience, Cadence offers a comprehensive 3D-IC design solution to address the requirements for digital SoCs, analog/mixed-signal designs, and entire systems. The comprehensive solution spans integration, packaging, custom and digital implementation, verification, system analysis, and interconnect IP for chiplet-based designs.
Key industries for advanced packing include areas in which design complexity exceeds the reticle limits, like hyperscale computing, as well as areas that benefit from special packaging needs and fast design iterations based in chiplets, like consumer and healthcare.
Using this solution, you can generate higher bandwidth, lower power consumption, and reduced area without traditional process scaling for applications ranging from AI and data center to graphics and small-form factor mobile communication ICs. It allows heterogeneous integration of different dies for 2.5D or 3D designs while providing power efficiency through smaller interconnects without compromising performance.
Continuing its tradition of packaging innovation, Cadence introduced the industry’s first integrated, high-capacity 3D-IC platform in 2021. It enables 3D chip and packaging planning, implementation, and system analysis in a single, unified cockpit, delivering system-level PPA advantages for multi-chiplet designs as well as faster turnaround times.
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