John Park is the Product Management Group Director for Advanced Semiconductor Packaging at Cadence. He leads a team responsible for defining cross-domain solutions and methodologies for IC, package, and PCB co-design and analysis. He is especially focused on developing tools and flows for chiplet-based 3D designs. He has over 40 years of experience in the EDA field and is regarded as an international expert on chiplets, packaging, and heterogeneous integration. John has given many conference presentations, done webinars and speeches, and written several articles.