Latest Posts - Page 2
SEMI Europe 3D & Systems Summit 2024 Community Member Preview
The 2024 SEMI Europe 3D & Systems Summit takes place on June 12-14 at the Hilton Hotel in Dresden, Germany....
ECTC 2024 3D InCites Community Member Preview
2024 is a big year for 3D InCites members at the Electronic Components and Technology Conference (ECTC). With 34 of...
March Member Highlights: Anniversaries, Events, Collaborations, New Products, and More
March buzzed with innovation and collaboration in the semiconductor industry, as key players across the globe joined forces to advance...
IMAPS DPC 2024 Community Member Preview
IMAPS 20th Annual Device Packaging Conference – Event Highlights The International Microelectronics Assembly and Packaging Society (IMAPS) 20th annual Device...
SEMICON China 2024 Community Member Preview
SEMICON China 2024 takes place March 20-22 at the Shanghai New International Expo Centre. This year’s event is expected to...
February Member Highlights – Acquisitions, Awards, Events, New Offerings and More
The 3D InCites community members continue to create a buzz with announcements from new acquisitions to industry awards, new product...
Member Monthly Highlights – November
IMAPS held its Arizona Chapter Event at Deca Technologies, which included a presentation from Clifford Sandstrom on: “Achieving High-Density Die-to-Die Integration with...
SEMICON Europa 2023 Community Member Preview
SEMICON Europa 2023, co-located with productronica in Munich, Germany makes for one of the strongest single events for electronics manufacturing...
Community Member Monthly News – October
October flew by and our community members were busy… Deca was the recipient of the prestigious IMAPS Corporate Recognition Award...
IMAPS Keynotes Focus on Heterogeneous Integration for HPC, AI, and EVs
This year’s IMAPS keynotes focused on advancements in heterogeneous integration (HI) technologies and chiplet architectures enabled by HI, driven by...
The IMAPS 2023 International Symposium Inspires Generations of Microelectronics Leaders
It wasn’t long ago that the IMAPS International Symposium focused mainly on legacy packaging technologies, occasionally dipping its toe in...
ASE Launches its Integrated Design Ecosystem™ to Enable Silicon Package Design Efficiencies that Reduce Cycle Time by Half
SUNNYVALE, Calif., Oct 3rd, 2023 – Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE:...
Community Member Monthly News – September
Let’s catch up on what we missed among our community… Cadence completed the acquisition of the SerDes and memory...
IMAPS San Diego Community Member Preview
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This...
SEMICON Taiwan – Community Member Preview
SEMICON Taiwan is arguably the most influential semiconductor event in Taiwan, reaching records high in terms of scale in its...
CHIPCon 2023: Demystifying the Chiplet Ecosystem
IMAPS‘ inaugural CHIPCon 2023 – the reinvention of its Advanced SiP Conference – took place July 24-27 in San Jose....
A Recap of the 2023 IEEE 3DIC Conference
The IEEE International 3D Systems Integration Conference (2023 IEEE 3DIC Conference) 2023 was held at Tyndall National Institute, University College...
CHIPcon Community Member Preview
The top global event for Chiplet and Heterogeneous Integration Packaging (CHIP), covering advanced technology developments and solutions, device integration strategies,...
