Peter Ramm from Fraunhofer EMFT Munich is head of Strategic Projects, responsible for initiation and steering of strategic projects and international research co-operations. He received Masters and Dr. rer. nat. degrees from the University of Regensburg and subsequently worked for Siemens in their DRAM facility where he was responsible for the overall process integration with a focus on backend-of-line. In 1988, he joined Fraunhofer Munich, working mainly on integration technologies for innovative devices and heterogeneous systems including the development of 3D TSV processes. Peter Ramm received the "Ashman Award” in 2009 from IMAPS and the 2020 IEEE EPS Technical Field Award “For Pioneering Contributions Leading to the Commercialization of 3D Wafer and Die level Stacking Packaging”. He is Senior Member IEEE, IMAPS Fellow, and Life Member. Peter Ramm serves as chair of the IEEE Technical Committee 3D/TSV.