Dr. Peter Ramm is responsible for the key competence “Si Processes, Device and 3D Integration”. He received physics and Dr. rer. nat. degrees from the University of Regensburg and subsequently worked for Siemens in the DRAM facility where he was responsible for process integration. In 1988 he joined Fraunhofer IFT in Munich, focusing for more than 25 years on 3D integration technologies. Peter Ramm is author or co-author of over 100 publications and 24 patents. He received the “Ashman Award 2009″ from the International Electronics Packaging Society (IMAPS) “For Pioneering Work on 3D IC Stacking and Integration, and leading-edge work on SiGe and Si technologies”. Peter is Fellow and Life Member of IMAPS, organizing committee and founding member of IEEE 3DIC conference and co-editor of Wiley´s “Handbook of 3D Integration”, vol. 1, 2 & 3 and Wiley´s “Handbook of Wafer Bonding”.