The 17th Annual Device Packaging Conference (DPC 2021) will be held as an online global event, from April 12-15, 2021. It is an international...
Heterogeneous integration (HI) is fast becoming a key driver of semiconductor development due to its ability to scale the number...
Like every other awards event in the past year, the 2021 3D InCites Awards Program had to make some adjustments...
We took our annual mural project online this year! Illustrator Ronna Encarnacion created this original watercolor to reflect the importance...
For the last several years, we held the 3D InCites Mural Project, in conjunction with the 3D InCites Awards, in...
TEMPE, Arizona – March 18, 2021 – Deca, an industry-leading pure-play technology provider for advanced semiconductor packaging, announced the introduction...
As part of our annual 3D InCites Awards program, we decided this year to turn the spotlight on two areas...
SEMICON China attracts the world’s leading technology companies who design, develop, manufacture, and supply the technologies to manufacture the microelectronics...
While most of SEMI’s global events went virtual in 2020, SEMICON Europa was straight-up canceled. While I was disappointed, since...
Siemens Digital Industries Software today announced that its collaboration with Advanced Semiconductor Engineering, Inc. (ASE) has generated two new enablement...
2020 proved to us that our world is wholly unpredictable. As the year began with optimism for a new decade...
More on TSMC’s SoIC Hybrid Bonding Technology Nikkei Asia announced that TSMC is working with Google and AMD to develop...
2020 has been a year for the books. Honestly, between the divisiveness in the USA caused by this year’s election...
Because IMAPS is a society, there is a strong community aspect to its events. It was good to see that...
It’s funny. While COVID 19 has restricted our lives in many ways, in others it’s made things more possible. Take...
If you love, like me, to work on the bleeding edge of technology, you will find that your personal success...
At the end of the 1st quarter and into early June, the thinking was that the semiconductor and packaging industry...
If you’ve attended the IMAPS Device Packaging Conference over the past three years, you probably noticed a hand-drawn mural coming...
We have known for some time that with scaling coming to an end the industry would need to find another...
There’s no doubt about it. This is a good time to be in the microelectronics and packaging sector of the...