SEMI and TechSearch International announced that the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the US$26.1 billion in revenue it logged in 2022, in their new Global Semiconductor Packaging Materials Outlook report. High-performance applications, 5G, artificial intelligence (AI) and the adoption of heterogeneous integration and system-in-package (SiP) technologies are increasing demand for advanced packaging solutions.

KLA Corporation and imec announced the intention to establish the Semiconductor Talent and Automotive Research (STAR) initiative, focusing on developing the talent base and infrastructure necessary to accelerate advanced semiconductor applications for electrification and autonomous mobility and move the automotive industry forward.

Nordson Test and Inspection exhibited its CyberOptics SQ3000 multi-function system for AOI, SPI and CMM, along with the X3 AXI system at SMTConnect, in Nuremberg, Germany.

PDF Solutions announced the successful implementation of Exensio Fabless Manufacturing Analytics Cloud as the Big Data Analytics Platform at Silicon Motion. The solution helps eliminate conflicts and redundancies in data handling.

The team at LPKF won an award from Georgia Tech for its groundbreaking work and pioneering contributions on Through Glass Via formation. TGV formation has emerged as a pivotal advancement in the field of advanced packaging, enabling higher levels of integration and improved performance in electronic systems.

ASE’s Charles Lee was at SEMICON SEA 2023 presenting the impact of advanced packaging and how ASE is contributing to the growth of the ecosystem through innovation and creative solutions. ASE’s VIPACK is driving the advancement of heterogeneous integration and the implementation of viable chiplet packaging solutions.

TechSearch International released another detailed product teardown report, this time it is the Xiaomi 12 smartphone. This report examined 168 packages, is 261 pages and includes high-resolution chip package photos, x-rays and measurements.

ASE’s Sol (Shlomo) Gradman moderated a panel discussion at ChipEx 2023 in TelAviv. Particularly, congratulations to Sol for moderating such an interesting panel discussion, featuring Renana Ashkenazi, Christie Simons, and Ori Tadmor alongside ASE’s Ingu Yin Chang. While addressing the ‘major trends that will shape the semiconductor industry, Yin described the emergence of chiplets and the enabling role of advanced packaging innovation in this new wave of AI, HPC, and automotive, while giving consideration to supply chain dynamics and geopolitical challenges.

Evatec attended SEMICON SEA 2023 highlighting the performance of its new HEXAGON platform for Fanout and WLCSP to thin film production solutions for augmented reality and EELs for optical communication.

Siemens EDA participated in an event at the University of Pavia “University & Students Meet Electronic Companies,” where young engineers and talents met each other to discover the exciting world of Electronic Design Automation for the Semiconductor industry.

SurplusGLOBAL CEO Bruce KIM delivered an engaging speech at SEMICON SEA 2023 on “Contributing to the Semiconductor Eco-System with Secondary Equipment and Parts.” His insights shed light on the vital role of secondary equipment and parts in the semiconductor industry.

KLA Foundation and KLA employee volunteers helped to advance science, technology, engineering and math (STEM) education by supporting dozens of U.S. high school teams participating in the FIRST® Robotics Silicon Valley Regional event. KLA’s sponsored Team 649 from Saratoga High School won the Engineering Inspiration Award, then advanced to the 2023 FIRST Championship in Houston, ranking 17th of 77 teams to become finalists in their division and making it to the event’s First Seed Alliance.

As part of the Ajinomoto Group’s Victory Project®, the company established a partnership agreement with Breakdance Division of Japan Dance Sport Federation (JDSF). With this agreement, Ajinomoto Co., Inc. started to support Japanese athletes who compete in breaking through Kachimeshi®, the Group’s nutrition program that focuses not on what to eat, but rather the purpose for eating to help athletes achieve their goals.

Nordson helped MiraCosta College launch the Open Doors internship program which increases opportunities for students of color to access paid internships.

ClassOne Technology applications engineer, Farzaneh Sharifi, hosted the Advanced Electroplating Workshop during CS Mantech 2023.

Trine Pierik

Trine Pierik is the 3D InCites community membership director. She is responsible and committed to…

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