Advanced packaging has entered its most successful era boosted by a need for better integration, the end of Moore’s law and, beyond that, the megatrends, transportation, 5G, consumer, memory & computing, artificial intelligence (AI) and high-performance computing (HPC).

The market today is dominated by large integrated device manufacturers (IDMs), such as Intel and Samsung, top four global outsourced semiconductor assembly and test service (OSAT) providers, and a foundry with packaging house – TSMC, which jointly accounted for 62% of the total advanced packaging revenue. These leaders are working on numerous innovative advanced packaging platforms such as flip-chip BGA, fan-out (FO) packaging, 3D through silicon vias (TSVs) and more… to answer to the market needs. Each platform has a lot of momentum but has different potential and different characteristics.

In 2015, the Fan-Out market was small and consisted mostly of standard devices like baseband (BB), radio frequency (RF), and power management units (PMUs). But after TSMC’s 2016 game changer with inFO for Apple’s iPhone APE, the market value increased 4x by 2018. Thus, the high-density fan-out (HDFO) market segment was created, reducing the market-share ratio of OSATs.

Today, the fastest growing platform is, without doubt, FO packaging, with 25% CAGR growth and experiencing a diversification of its targeted applications beyond the consumer world. Moreover, this year FO packaging appears once again to be one of the most dynamic technologies, though needing a new wave of cost decreases to become even more widespread. This shall be achieved thanks to the move toward panel scale, once ambitious challenges have been overcome by the industry. The FO market will reach almost US$3.8 billion by 2024. [1]

Fan out packaging evolution: A long and volatile journey, yet history is still in the making…

A few years ago, Yole Développement (Yole) and NCAP China decided to create a unique place in the world where leading companies could share their vision of the industry, evaluate the emerging platforms, and identify business opportunities.

Today, both partners confirm their success with the 5th Advanced Packaging & System Integration Technology Symposium. Yole and NCAP China have combined their expertise to offer a powerful program directly related to the impact of megatrends on the advanced packaging industry.

With unique access to leading players and experts, the Advanced Packaging & System Integration Technology Symposium will take place in Shanghai at the end of the month and presents five key industry focuses: AI & HPC, memory & computing, transportation, 5G, and consumer. The Organizing Committee is offering about 20 inspiring presentations, two market briefings and several networking times to cover a broad range of topics.

The Advanced Packaging & System Integration Technology Symposium program follows the industry evolution and the emergence of innovative technologies. Based on the FO attractiveness, Yole and NCAP China propose several impressive presentations focused on this advanced packaging platform, especially with Bosch Sensortec’s keynote presentation: Mrs. Bin Fu, Head of Business Development and Marketing, China, at Bosch Sensortec will take a closer look at how smarter sensors can contribute to the edge IoT edge trend, from the perspective of a sensor solution innovator.

In parallel, Farhang Yazdani, President & CTO, Broadpak, will be delivering the keynote presentation dedicated to the AI & HPC megatrend: “Semiconductor industry is at a turning point: the slowdown in CMOS scaling and escalated costs have prompted the industry to rely on IC packaging industry to extend the benefits of more-than-Moore era”, asserts Farhang Yazdani from Broadpak. Learn more here.


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