5th Advanced Packaging & System Integration Technology Symposium

5th Advanced Packaging & System Integration Technology Symposium

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Date/Time
Date(s) - 04/22/2019 - 04/23/2019
All Day

Location
National Center for Advanced Packaging

Category(ies)


With unique access to leading players and experts, the Advanced Packaging & System Integration Technology Symposium will take place in Shanghai at the end of the month and presents five key industry focuses: AI & HPC, memory & computing, transportation, 5G, and consumer. The Organizing Committee is offering about 20 inspiring presentations, two market briefings and several networking times to cover a broad range of topics…

The Advanced Packaging & System Integration Technology Symposium program follows the industry evolution and the emergence of innovative technologies. Based on the FO attractiveness, Yole and NCAP China propose several impressive presentations focused on this advanced packaging platform, especially with Bosch Sensortec’s keynote presentation: Mrs. Bin Fu, Head of Business Development and Marketing, China, at Bosch Sensortec will take a closer look at how smarter sensors can contribute to the edge IoT edge trend, from the perspective of a sensor solution innovator.

In parallel, Farhang Yazdani, President & CTO, Broadpak, will be delivering the keynote presentation dedicated to the AI & HPC megatrend: “Semiconductor industry is at a turning point: the slowdown in CMOS scaling and escalated costs have prompted the industry to rely on IC packaging industry to extend the benefits of more-than-Moore era”, asserts Farhang Yazdani from Broadpak.

This Shanghai symposium has the opportunity to welcome leading companies as speakers:

Amkor Technology, AT&S China, BESI, Bosch Sensortec, Boschman Advanced Packaging Technology, Brewer Science, Broadpak, China WLCSP, ERS electronic, JCET, KLA, Kulicke & Soffa, NCAP China, SiPlus, SPIL, System Plus Consulting, TDK InvenSense, TD-Sien Integrated Circuit, Unisoc, Visionox Technology, Xilinx and Yole Développement.

Moreover, the 2019 Symposium is supported by:

SPTS Technologies, an Orbotech Company, ULVAC, Besi, Bowman, Hanmi, ERS Electronic, Kulicke & Soffa and ASM Assembly Systems.

Yole Développement’s packaging and substrate analysts invite you to gain an in-depth understanding of the industry evolution and technology issues, with two dedicated market briefings focused on AI & HPC, memory & computing, transportation, consumer and 5G, moderated by Yole’s Semiconductor & Software team: Emilie Jolivet – Division Director, Favier Shoo – Technology & Market Analyst and Santosh Kumar – Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea,  as well as Thibault Buisson, the Chief Operating Officer.

They will describe the new ecosystem currently emerging, pushed by the needs of innovative and disruptive technologies. Analysts will also detail the industry evolution and its consequence at each step of the supply chain.

Registration & sponsorship opportunities are available on i-micronews.com.