Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 12-14, 2024, in Dresden for insights into the latest heterogeneous integration innovations for semiconductor applications enabling the future of intelligent and sustainable systems. Registration is open.
Themed Heterogeneous Systems for the Intelligently Connected Era, this year’s SEMI 3D & Systems Summit will feature a broader scope of topics including market trends, chiplet design, hybrid bonding, Co-Packaged Optics (CPO), high-bandwidth computing and environmental sustainability.
3D Summit Sessions
Session 1: Semiconductor Market Trends and European Impact
Executive leaders will analyze the dynamic relationship between global semiconductor trends and the European landscape, highlighting the implications for Europe’s economic expansion and technological progress.
Session 2: Chiplet System Architectures – Design and Technologies
Industry experts will delve into dynamic chiplet design, emphasizing innovative approaches, emerging trends, optimization strategies, and packaging solutions that drive chiplet innovations.
Session 3: Hybrid Bonding Technologies for Advanced 3D Integration
Specialists will spotlight the latest advancements in hybrid bonding technologies, focusing on recent developments, novel techniques, and emerging applications. Speakers will highlight hybrid bonding’s transformative potential for enhancing semiconductor performance and overall functionality.
Session 4: Manufacturing Innovation for 3D Integration
Visionaries will showcase the newest hybrid bonding advancements, emphasizing their potential to enhance chip performance, efficiency, and functionality through recent innovations and emerging applications.
Session 5: Co-Packaged Optics (CPO) – Innovations for High Bandwidth Computing
Leaders will explore CPO as an advancement in integrated photonics, highlighting its cost-effectiveness, enhanced integration, and potential to improve performance in data transmission and processing systems.
Session 6: Materials and Processes Supporting Environmental Sustainability
Experts will spotlight semiconductor industry efforts to prioritize environmental sustainability through collaboration, innovation, and a continued commitment to exploring eco-friendly alternatives and reducing the industry’s environmental footprint.
Members of the 3D InCites Community who will be presenting include:
- EV Group
- Fraunhofer IZM-ASSID
- KLA Corporation
- MKS-Atotech
- SPTS Technologies Ltd., a KLA company
- TechSearch International, Inc.
Exhibition and Business Networking
The 3D & Systems Summit will also feature business-to-business matchmaking and networking for participants to explore new partnerships and other business opportunities.
This year’s networking reception will take place at the Hilton Dresden on the first day of the event, and the annual networking dinner will be held on the Elbe River cruise. Networking Dinner registration is reserved exclusively for 3D & Systems Summit 2024 participants. Guests may register their spouse for dinner by completing the spouse registration form.
Premium Sponsors who are also 3D InCites Members include:
Adeia, ASE, EV Group, Heidenhain, KLA, Lam Research, MKS-Atotech
