03/18/2024 - 03/21/2024 -12:00 am

Location: WekoPa Resort

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The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

General Chair:

Scott Hayes, NXP

General Chair-Elect (2025):

Amy Lujan, SavanSys

Past General Chairs:

Nokibul Islam, JCET Group (2023)
Prasad Dhond, Amkor Technology (2022)

Submit Abstract/PDC

due by October 13

 Here are the important dates for sign-up and selection of exhibit space:
Now through September 6, 2023Phase 1: Committing Major Sponsors Only
September 7 –
October 9, 2023
Phase 2: Returning Exhibitors from DPC 2023
October 10 – ShowPhase 3: Open Application Period


WeKoPa Resort
10438 WeKoPa Way | Fort McDowell, AZ 85264

Hotel deadline: February 12, 2024

Single/Double: $199/night + taxes and fees (single/double)


Phone Reservations: 480-789-5300
You must mention IMAPS

Reservations must be made before the cutoff date.
Change or cancel up to 72 hours before arrival. Room only – deposit may be forfeited.

The above link and phone number is the only official way to book your hotel for IMAPS DPC. IMAPS does not have a room block at any other hotel and does not work with a housing bureau.