Latest Posts
Direct Bond Interconnect (DBI®) Technology as an Alternative to Thermocompression Bonding
The industry standard interconnect technology for fine-pitch 2.5D assembly and 3D stacking is thermocompression bonding of solder capped μbumps. This...
Kulicke & Soffa Stack the Dice for 2.5D and 3D IC Assembly
It’s been a long time coming, but Kulicke & Soffa has seen the writing on the wall, and it reads:...Thermocompression Bonding for Microbump Flip Chip Soldering
An excerpt from the Semiconductor Assembly Blog by Andy C. Mackie, Global Product Manager for Indium Corporation's Semiconductor and Advanced...Gearing up for IITC in 3D
This year’s 2010 IEEE International Interconnect Technology Conference (June 7-9, Burlingame, CA) has caught the 3D...
