Micross (www.micross.com) is the leading one-source, one-solution provider of bare die & wafers, wafer bumping & advanced interconnect technologies, custom packaging & assembly, component modification services, electrical & environmental testing and Hi-Rel products to manufacturers and users of semiconductor devices. In business for 40+ years, our comprehensive array of hi-reliability capabilities serves the global aerospace & defense, space, medical and industrial markets. Micross possesses the sourcing, packaging, assembly, test and logistics expertise needed to support an application throughout its entire program cycle.
Micross Advanced Interconnect Technology (AIT), a specialized division of Micross, is an ITAR-registered and Trusted Source U.S. based, AS9100D/ISO9001 certified microfabrication facility with 20+ years of experience developing and providing leading edge interconnect and 3D integration technologies (wafer bumping, TSV, Si interposers, 3D IC) for a wide variety of Defense and Hi-Reliability customers.
Micross AIT supports multiple advanced interconnect and assembly technologies facilitating next-generation electronic systems, including wafer level packaging processes for solder (Pb-based and Pb-free) and Cu pillar bumping, high density (fine pitch) interconnects, through silicon vias (TSV) and silicon and glass interposers. Together, these capabilities support a breadth of 2.5 and 3D heterogeneous integration packaging options. Micross AIT works with commercial, private, and government customers to provide unique solutions to even the most challenging interconnect and packaging requirements. Recently, Micross AIT has received accreditation by the Defense Microelectronics Activity (DMEA) as a Microelectronics Trusted Source provider for Post CMOS Processing Services (Category 1A). For additional information about Micross AIT and all its capabilities, visit http://bit.ly/2wfyK82