Orlando, FL, January 15, 2020 – Micross is pleased to announce that its Advanced Interconnect Technology operation (Micross AIT) located in Research Triangle Park, North Carolina has been accredited by the Defense Microelectronics Activity (DMEA) as a Microelectronics Trusted Source for Post CMOS Processing Services (Category 1A) effective December 13, 2019.

Micross AIT houses an ITAR-registered, state-of-the-art AS9100D/ISO9001:2015 certified microfabrication facility that provides development, custom (flexible) prototyping and production services for a wide variety of Defense and Hi-Reliability customers.

Micross AIT supports multiple advanced interconnect and assembly technologies facilitating next-generation electronic systems, including wafer-level packaging processes for solder (Pb-based and Pb-free) and Cu pillar bumping, high density (fine pitch) interconnects, through silicon vias (TSV) and silicon and glass interposers.  Together, these capabilities support a breadth of 2.5 and 3D heterogeneous integration packaging options.  Micross AIT works with commercial, private, and government customers to provide unique solutions to challenging interconnect and packaging requirements. With this certification, Micross AIT can now serve designated Trusted Programs as a post-CMOS processing services provider.

“Micross AIT is extremely proud to obtain this Microelectronics Trusted Source accreditation.  This reflects the integrity, pride and hard work of the AIT Team.  For more than 25 years, Micross AIT has been at the cutting-edge in the development and implementation of interconnect and packaging technologies; this certification re-confirms our critical Mission in support of the Defense Industrial Base (DIB),” stated John Lannon, General Manager of Micross AIT.

For additional information about Micross AIT and all its capabilities, visit http://bit.ly/2wfyK82

Contact Alan Huffman, Director of Engineering at Alan.Huffman@micross.com


Micross (www.micross.com) is the leading one-source, one-solution provider of bare die & wafers, wafer bumping…

View Micross's posts

Become a Member

Media Kit