wafer-level packaging

Pasadena offers Roses and Technology

Pasadena offers Roses and Technology

California’s Pasadena is well known for the New Year Rose Parade and the Rose Bowl. There is no doubt: It takes commitment and organizational talent to make these events successful for 100+ years, and encourage every contributor to prepare and execute successful events every year. Last week’s International Microelectronics Assembly and Packaging Solutions Conference (iMAPS) in Pasadena’s Con... »

SUSS MicroTec Receives Order for Next-Gen Projection Scanner DSC300 Gen2

SUSS MicroTec Receives Order for Next-Gen Projection Scanner DSC300 Gen2

Garching, June 12, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has successfully qualified its new DSC300 Gen2 projection lithography system for volume production at a major Asian packaging house (OSAT). The customer will use the ordered equipment for volume production of FlipChip and Wafer Level Packaging (WLP) ap... »

Wafer Level Packaging and Stacking take Center Stage at Asia Conferences

Wafer Level Packaging and Stacking take Center Stage at Asia Conferences

I thought I would go to Singapore, attend EPTC (Electronic Packaging Technology Conference 2013) and then take off on my personal vacation to India to attend my 40th high school reunion and 35th college reunion – two weeks tops. It escalated quickly. It ended up being 34 day, 20 city, 6 country marathon. Why you ask? Either I was not willing to give up on the opportunity to meet with packaging t... »

Rudolph Announces New Metrology Suite for Advanced Packaging

Rudolph Announces New Metrology Suite for Advanced Packaging

New NSX Metrology Series includes application-specific configurations to address unique metrology requirements for wafer level packaging, 2.5D and 3DIC  Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, today released three new application-specific configurations ... »

How will the 450mm Transition Affect Advanced Packaging and 3D ICs?

How will the 450mm Transition Affect Advanced Packaging and 3D ICs?

That was my kick-off question for Manish Ranjan, Vice President, Product Marketing, Advanced Packaging/Nanotechnology Segment at Ultratech, during our annual SEMICON West Thursday wrap-up discussion. It’s never been planned that way, but I always seem to interview Ranjan at the tail-end of SEMICON West, and subsequently end up bouncing a weeks accumulation of thoughts off of him. What inspired t... »

Talking 3D with Manish Ranjan

I’ll never forget the first time I interviewed Manish Ranjan of Ultratech. It was during my first SEMICON West experience in 2006. I was still wet behind the ears, faking my way through most interviews. The easiest ones were with the companies who just wanted to talk about their latest product launches. Not so with Manish. He started talking to me expert-to-expert, offering market analysis, disc... »