SUSS News
SUSS MicroTec Launches XB8 – a New Semi-Automated High-Force Wafer Bonder
Garching, September 17, 2015 – SUSS MicroTec, a global supplier of equipment and applications for the semiconductor industry and related... New Competence Center for Nanoimprint in North America
Garching/Germany, August 18, 2015 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and... SUSS MicroTec Launches SB6/8 Gen2: A Next-Generation Semi-Automated Permanent Wafer Bonder
Garching, October 7, 2014 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related... SUSS MicroTec launches ELD300 Excimer Laser Debonder for 3D Integration
Garching, July 8, 2014 – SÜSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related... SUSS MicroTec Receives Order for Next-Gen Projection Scanner DSC300 Gen2
Garching, June 12, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and... SUSS MicroTec launches the new Mask Aligner MA12
Garching, April 29, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and... SUSS MicroTec Launches Mask Aligner MA200 Gen3
Garching, April 2, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and... SUSS MicroTec launches DSC300 Gen2: Next Generation Projection Scanner for Advanced Packaging
Garching, March 4, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and... 