Garching, February 19, 2014 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, announced the launch of its ELP300 Gen2. This latest generation of excimer laser steppers provides a means to directly create vias (< 5µm) and microstructures, addressing the limitations of traditional photo-dielectrics and photolithography steppers for Advanced Packaging and 3D processing applications.
The Wafer Level Packaging (WLP) industry has long requested the support of alternative via generation systems that enable the development of higher performance packages. With Excimer laser ablation, alternative organic polymers can be used, which contain enhanced mechanical, physical, thermal and chemical properties, to lower cure temperatures and Coefficient Thermal Expansion (CTE) stresses. In addition, due to the ablation characteristics of the Excimer laser system, the ELP300 Gen2 provides a means to attain smaller via sizes and decreased via pitch for next generation packaging requirements.
Configured for handling both 200mm and 300mm wafers the ELP300 Gen2 platform represents a highly attractive solution that meets the technology driven requirements of the Advanced Packaging and 3D industry.
“The demand for alternative patterning technologies that can address the limitations of traditional photolithography and photo-dielectrics is obvious”, says Frank Averdung, President and CEO of SUSS MicroTec. “Our new generation of Excimer laser systems will allow our customers to address the latest technical requirements with a highly cost efficient solution.”