lithography

Supporting the 3D Megatrend in Semiconductor Manufacturing

Supporting the 3D Megatrend in Semiconductor Manufacturing

We’ve waited a long time for this, and now it’s here. There is a 3D megatrend happening in semiconductor manufacturing, as scaling alone does not meet the sophisticated computing needs of Industry 4.0 applications like blockchain, 5G, the internet of things (IoT), autonomous transportation, telemedicine, and more. These emerging technologies call for more advanced technologies like artificial ... »

Megatrends are Changing the Future of the Lithography Equipment Market

The overall semiconductor equipment market is today worth several billion dollars. By contrast, the permanent bonding, temporary bonding and debonding and lithography equipment market for the more than Moore (MtM)  industry is a small niche representing millions of dollars. However, megatrend markets push MtM devices to new levels of complexity, resulting in big investments. Consequently, the tot... »

Volumes Matter and Other Conversations from SEMICON West 2018

Volumes Matter and Other Conversations from SEMICON West 2018

The world wants intelligence in everything, especially things that aren’t nailed down like autonomous cars, and the internet of things (IoT) devices. And suddenly, semiconductors are the hottest game in town. Here’s how some of these trends are impacting suppliers that I spoke with at SEMICON West. The importance of purity While Entegris is agnostic to megatrends, Jim O’Neill, CTO, still... »

EMD Performance Materials Announces Comprehensive Materials Solutions for Chip Miniaturization and Smart Packaging

EMD Performance Materials Announces Comprehensive Materials Solutions for Chip Miniaturization and Smart Packaging

  Philadelphia PA, USA, July 10, 2017 – EMD Performance Materials, a leading science, and technology company, today announced its portfolio of materials solutions for advanced semiconductor manufacturing. Megatrends represented by big data, automotive electronics, IoT, and an increased interest in green assembly, is expanding the need for advanced semiconductor processing and novel materi... »

Leti Orders HERCULES® NIL System from EV Group for Joint Nanoimprint Lithography Program

Leti Orders HERCULES® NIL System from EV Group for Joint Nanoimprint Lithography Program

Nanoimprint lithography (NIL) system will bolster process development and demo capabilities of INSPIRE program EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, and Leti, an institute of CEA Tech, announced today that Leti has ordered a HERCULES® NIL track system from EVG. The HERCULES NIL system will be install... »

Executive Viewpoint: Lithography’s Rising Star in the Year of the Fan-Out Package

Executive Viewpoint: Lithography’s Rising Star in the Year of the Fan-Out Package

There is no doubt about it, 2016 is turning out to be the year of fan-out wafer level packaging (FOWLP) as the entire semiconductor industry turns to advanced wafer level packaging and system-in-package solutions to take the world to its next generation of connectivity, in which our smartphones drive our lives, and the Internet of Things becomes a reality. While lithography is often thought of as ... »

Rudolph JetStep Lithography System Selected for  First Panel Fan-out Packaging Manufacturing Line

Rudolph JetStep Lithography System Selected for First Panel Fan-out Packaging Manufacturing Line

Flanders, New Jersey —Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading outsourced assembly and test facility (OSAT) has placed an order for the JetStep® Lithography System for the semiconductor advanced packaging industry’s first panel fan-out manufacturing line. The JetStep S Series Lithography System was selected after a thorough evaluation of competitive offerings, a... »

Semiconductor Supplier Updates from SEMICON West 2015

Semiconductor Supplier Updates from SEMICON West 2015

No SEMICON West would be complete without a few laps around Moscone North and South, and some one-on-one chats with suppliers. I stopped in to see several semiconductor supplier companies who annually request an audience with the Queen of 3D to talk about their latest accomplishments, as well as gain some insight on their perspective of the industry. I had my 9th annual briefing with Manish Ranjan... »

Lithography Challenges for 2.5D Interposer Manufacturing

Lithography Challenges for 2.5D Interposer Manufacturing

In recent years, 2.5D packaging has quickly gained acceptance as an advanced packaging process, and the first products using this technology are now coming to market.¹ Most estimates project growth for 2.5D interposer packaging faster than the industry as a whole. Similar to the multi-chip modules (MCMs) of the past, 2.5D packaging processes use an interposer with vias connecting the metallizatio... »

Lithography Process Innovations for 2.5/3D Part 1: Alleviating TSV Stress

Lithography Process Innovations for 2.5/3D Part 1: Alleviating TSV Stress

As traditional semiconductor scaling becomes increasingly complex and cost-prohibitive, transitioning from planar chip packaging architectures to 2.5D/3D stacked die package architectures has become key to enable the integration of greater amounts of chip functionality in smaller form factors. This need for form factor reduction, together with smaller process geometries and higher-count I/O on int... »

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