Latest Posts - Page 2
Lithography Challenges for 2.5D Interposer Manufacturing
In recent years, 2.5D packaging has quickly gained acceptance as an advanced packaging process, and the first products using this... Lithography Process Innovations for 2.5/3D Part 1: Alleviating TSV Stress
As traditional semiconductor scaling becomes increasingly complex and cost-prohibitive, transitioning from planar chip packaging architectures to 2.5D/3D stacked die package...
SUSS MicroTec Launches Mask Aligner MA200 Gen3
Garching, April 2, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and... SUSS MicroTec launches DSC300 Gen2: Next Generation Projection Scanner for Advanced Packaging
Garching, March 4, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and... SUSS MicroTec launches ELP300 Gen2: The Latest Generation of Excimer Laser Steppers
Garching, February 19, 2014 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and... EV Group Unveils HVM Photoresist Processing System for Logic and Memory Advanced Packaging Applications
ST. FLORIAN, Austria, February 11, 2014 — EV Group (EVG), supplier of wafer bonding and lithography equipment for the MEMS,...
Europe in 3D: The EV Group Story Continues…
Rarely do I have the opportunity to visit a company two times and find something new to write about, never mind...
Rudolph Technologies’ Metrology, Inspection and Lithography Solutions for 2.5D and 3D TSVs
Here’s one thing the team at Rudolph has a firm grasp on: understanding that feature sizes of today’s wafer-level, 2.5D...
Sum of Minds – imec Makes the Unexpected Happen
In her opening remarks at the 2013 imec International Technology Forum (ITF), held Monday, July 8, 2013, Karen Savala, SEMI,...
