Garching, June 12, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has successfully qualified its new DSC300 Gen2 projection lithography system for volume production at a major Asian packaging house (OSAT). The customer will use the ordered equipment for volume production of FlipChip and Wafer Level Packaging (WLP) applications. The DSC300 has already demonstrated high yields at the customer site. With the intended installation of several further systems the customer will increase its production capacity to meet the growing market demand of leading edge smart devices and consumer electronics.
The DSC300 Gen2 provides projection lithography performance at a significantly lower cost of ownership compared to conventional projection steppers. Along with other key benefits, the DSC300 Projection Scanner will help this leading packing house to differentiate itself from its competitors.
“SUSS MicroTec is the only company worldwide offering the advantages of full field exposure technology with projection lithography in one tool.”, says Frank P. Averdung, President and CEO of SUSS MicroTec. “With the DSC300 Gen2 we have developed and launched an innovative but cost efficient projection lithography technology for high volume production in the semiconductor backend.”