Evatec has delivered its first dedicated CLUSTERLINE® 310 for panel level packaging on 310×310mm panel
formats to a leading global IDM. The tool will be used to support their next generation chip manufacturing and
integrates degas, etch and PVD technologies for processing of glass and highly outgassing organics. This
delivery marks the beginning of a robust pipeline of global customer orders, with further deliveries scheduled
over the coming months.
Evatec Business Field Manager Admir Asanoski commented: “As the market leader in delivering packaging
solutions for larger panels up to 650mm around the globe over the last 8 years, our team has gained a deep
understanding of the challenges of panel processing and the cost benefits of manufacturing on larger package
sizes in areas like HPC and AI. The emerging requests for 310mm solutions from our customers presented the
perfect opportunity for our team to leverage existing engineering and process know-how and fast track
development of a new dedicated tool for 310mm. From Fan-Out Panel-Level Packaging (FOPLP) to CoPoS
architectures, our new CLUSTERLINE® 310 solution delivers the required process uniformities and process
yield essential for a successful scale up with lower initial tool investment costs and built in platform flexibility
that supports our customers’ technology roadmaps. We are excited to be at the forefront of providing
production solutions in this rapidly growing market segment.”
About Evatec:
As a global leader in thin film technology Evatec designs and manufactures production systems for industry
across applications in Advanced Packaging, Semiconductor, Optoelectronics and Photonics, whilst its
customized engineering solutions support the equipment needed at the world’s leading R&D institutions. For
more information visit https://evatecnet.com. For press enquiries please contact Allan Jaunzens.
allan.jaunzens@evatecnet.com
