Latest Posts
Advanced Packaging Trends, Part I: Solving PR Strip and UBM/RDL Challenges
Over the years, the semiconductor industry has relentlessly focused on shrinking gate dimensions to drive performance. This focus has now...
The 14th 3D ASIP Conference Addresses a Spectrum of 0pportunities, Part 1
Several years before I started promoting 3D IC benefits in 2008, a small team of industry visionaries founded the 3D...
TechSearch International Analysis Examines FO-WLP Developments and Sensor Packaging Trends
Mobile devices, specifically smartphones, represent the single greatest volume driver for MEMS and other sensors today. Sensors found in these...
Meet Us at ECTC 2017 in Walt Disney World
As each year passes, advanced packaging technologies offer more versatile solutions for cost-effective low-end applications, while 3D integration advancements continue...
Pasadena offers Roses and Technology
California’s Pasadena is well known for the New Year Rose Parade and the Rose Bowl. There is no doubt: It...
Meet Me at ECTC 2016 in Las Vegas
With the industry-wide shift in focus from furthering Moore’s Law to the realization that 3D integration and advanced packaging technologies...
TechSearch International Analyzes Flip Chip and Wafer Level Package Growth
TechSearch International Analyzes Flip Chip and Wafer Level Package Growth Flip chip and wafer level package (WLPs) shipments continue to... IWLPC Best Papers Announced
SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were...
2014 Advanced Packaging and Integration Technology Symposium Spreads Message of Collaborative Innovation
Intent in fostering collaborative innovation across the supply chain, Yole Développement and the National Center for Advanced Packaging (NCAP) teamed...
SUSS MicroTec Receives Order for Next-Gen Projection Scanner DSC300 Gen2
Garching, June 12, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and...
Wafer Level Packaging and Stacking take Center Stage at Asia Conferences
I thought I would go to Singapore, attend EPTC (Electronic Packaging Technology Conference 2013) and then take off on my...
How will the 450mm Transition Affect Advanced Packaging and 3D ICs?
That was my kick-off question for Manish Ranjan, Vice President, Product Marketing, Advanced Packaging/Nanotechnology Segment at Ultratech, during our annual...What’s in Store for 3D Fans at IWLPC 2010
I was so busy making sure I have all the bios and presentations for the 3D sessions I’m chairing at...Manish’s Market Moment
For me, SEMICON West is never complete until I’ve had my sit-down with Manish...