WLP

TechSearch International Analysis Examines FO-WLP Developments and Sensor Packaging Trends

TechSearch International Analysis Examines FO-WLP Developments and Sensor Packaging Trends

Mobile devices, specifically smartphones, represent the single greatest volume driver for MEMS and other sensors today. Sensors found in these products include electronic compasses, motion sensors, barometers, microphones, and fingerprint sensors. Package types include land grid arrays (LGAs), lead frame packages such as QFNs, and wafer level packages (WLPs.). Apple is expected to account for 28 p... »

Meet Us at ECTC 2017 in Walt Disney World

Meet Us at ECTC 2017 in Walt Disney World

As each year passes, advanced packaging technologies offer more versatile solutions for cost-effective low-end applications, while 3D integration advancements continue to improve the performance of leading-edge products. This will be reflected at the 67th Annual Electronic Components and Technology Conference (ECTC), which takes place May 30, June 2, 2017, at the Walt Disney World Swan & Dolph... »

Pasadena offers Roses and Technology

Pasadena offers Roses and Technology

California’s Pasadena is well known for the New Year Rose Parade and the Rose Bowl. There is no doubt: It takes commitment and organizational talent to make these events successful for 100+ years, and encourage every contributor to prepare and execute successful events every year. Last week’s International Microelectronics Assembly and Packaging Solutions Conference (iMAPS) in Pasadena’s Con... »

Meet Me at ECTC 2016 in Las Vegas

Meet Me at ECTC 2016 in Las Vegas

With the industry-wide shift in focus from furthering Moore’s Law to the realization that 3D integration and advanced packaging technologies are the shining stars of the next generation of electronics, the 66th Annual IEEE Electronic Components Technology Conference, which takes place May 31-June 3, 2016, at the Cosmopolitan of Las Vegas, promises to be one of the best ever. The agenda boasts 39... »

Finetech’s Sigma Die Bonder High Accuracy Targets Advanced Wafer Level Packaging Applications

Finetech’s Sigma Die Bonder High Accuracy Targets Advanced Wafer Level Packaging Applications

GILBERT, AZ — August 6, 2015 — Finetech introduces its new FINEPLACER® Sigma bonder, designed to provide a solution for large die up to 100mm, combined with a working area of 450 x 300mm. The FINEPLACER® Sigma is ideally suited for high-density array applications and high bond force (up to 1000N) requirements, coupled with Finetech’s renowned sub-micron placement accuracy. The system is t... »

TechSearch International Analyzes Flip Chip and Wafer Level Package Growth

TechSearch International Analyzes Flip Chip and Wafer Level Package Growth

TechSearch International Analyzes Flip Chip and Wafer Level Package Growth Flip chip and wafer level package (WLPs) shipments continue to increase. TechSearch International’s new study, 2015 Flip Chip and WLP: Emerging Trends and Market Forecasts, provides unparalleled analysis of what’s behind the numbers for the growth of flip chip and wafer level packages (WLPs). Highlighted are the trends ... »

IWLPC Best Papers Announced

IWLPC Best Papers Announced

SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC brings together some of the semiconductor industry’s most respe... »

2014 Advanced Packaging and Integration Technology Symposium Spreads Message of Collaborative Innovation

2014 Advanced Packaging and Integration Technology Symposium Spreads Message of Collaborative Innovation

Intent in fostering collaborative innovation across the supply chain, Yole Développement and the National Center for Advanced Packaging (NCAP) teamed up to present the first Advanced Packaging and Integration Technology Symposium, August 28, 2014, in Wuxi, China. The one-day event attracted international participation from 48 organizations, with strong high level (52% executives) and Chinese (70%... »

SUSS MicroTec Receives Order for Next-Gen Projection Scanner DSC300 Gen2

SUSS MicroTec Receives Order for Next-Gen Projection Scanner DSC300 Gen2

Garching, June 12, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has successfully qualified its new DSC300 Gen2 projection lithography system for volume production at a major Asian packaging house (OSAT). The customer will use the ordered equipment for volume production of FlipChip and Wafer Level Packaging (WLP) ap... »

Wafer Level Packaging and Stacking take Center Stage at Asia Conferences

Wafer Level Packaging and Stacking take Center Stage at Asia Conferences

I thought I would go to Singapore, attend EPTC (Electronic Packaging Technology Conference 2013) and then take off on my personal vacation to India to attend my 40th high school reunion and 35th college reunion – two weeks tops. It escalated quickly. It ended up being 34 day, 20 city, 6 country marathon. Why you ask? Either I was not willing to give up on the opportunity to meet with packaging t... »

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