Advanced Packaging Challenges and Opportunities for 2015Feb 11, 2015 · By Rajiv Roy · Blogs Our industry is seeing greater diversification in manufacturing processes than it has since its earliest days. In the front-end numerous...
Wafer Level Packaging and Stacking take Center Stage at Asia ConferencesJan 16, 2014 · By Rajiv Roy · 3D Event Coverage I thought I would go to Singapore, attend EPTC (Electronic Packaging Technology Conference 2013) and then take off on my...
IMAPS International 2013 3D Technology HighlightsOct 23, 2013 · By Rajiv Roy · 3D Event Coverage Approximately 880 people registered for IMAPS International 2013, and yes the fiasco in Washington even affected IMAPS – there were...
The Hills are alive – in the Hill Country – The Interposer workshop in AustinMar 10, 2013 · By Rajiv Roy · 3D Event Coverage Did anyone miss the Sound of Music bit during the Oscars? Anyway, with the sounds of “The Hills are alive..”...