Advanced Packaging Trends, Part I: Solving PR Strip and UBM/RDL ChallengesFeb 27, 2018 · By Laura Mauer · Blogs Over the years, the semiconductor industry has relentlessly focused on shrinking gate dimensions to drive performance. This focus has now...
Notes from GIT 2013Nov 25, 2013 · By Laura Mauer · 3D Event Coverage The 3rd annual Global Interposer Technology Workshop (GIT 2013) was held at the Georgia Institute of Technology on November 18-20, 2013....
