Laura Mauer, Author at 3D InCites

Advanced Packaging Trends, Part I: Solving PR Strip and UBM/RDL Challenges

Advanced Packaging Trends, Part I: Solving PR Strip and UBM/RDL Challenges

Over the years, the semiconductor industry has relentlessly focused on shrinking gate dimensions to drive performance. This focus has now transitioned to the packaging side as customers are shifting from wire bonding to flip chip for use in wafer level packaging (WLP). According to VLSI Research, about 35% of chips are currently packaged using WLP techniques. Advanced packaging opportunities slowe... »

Notes from GIT 2013

Notes from GIT 2013

The 3rd annual Global Interposer Technology Workshop (GIT 2013) was held at the Georgia Institute of Technology on November 18-20, 2013. Over 200 people from 11 countries attended this in-depth and lively discussion about interposers. Although many people think the conference is focused on glass (Glass Interposer Technology – another use of the GIT acronym) there was ample time given to sil... »