Francoise von Trapp

They call me the “Queen of 3D” because I have been following the course of 3D integration and blogging about it since 2009. Francoisein3D is the featured blog on this…

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With the industry-wide shift in focus from furthering Moore’s Law to the realization that 3D integration and advanced packaging technologies are the shining stars of the next generation of electronics, the 66th Annual IEEE Electronic Components Technology Conference, which takes place May 31-June 3, 2016, at the Cosmopolitan of Las Vegas, promises to be one of the best ever. The agenda boasts 391 technical papers in 36 oral sessions and 5 interactive sessions that will cover all aspects of 3D and through-silicon via (TSV) technologies, wafer level packaging (WLP), flip chip, electrical and mechanical modeling, RF packaging, system design, materials, and optical interconnects. Additionally, special sessions will focus on some of the hottest industry topics. Here are the ones I plan to attend and cover on 3D InCites.

First on my list is the session entitled “Memory Technology Advances and Prospects for Packaging” chaired by Nanju Na, Xilinx. A panel of experts including Bryan Black, Advanced Micro Devices, Inc.; Sandeep Bharathi, Xilinx, Inc.; Nick Kim – SK Hynix, Inc.; Craig Hampel, Rambus, Inc. and Ravi Mahajan, Intel Corporation will discuss how packaging is enabling the advances in memory technologies.

If you’ve ever wondered how NASA managed to land the Curiosity Rover on Mars, then you won’t want to miss the Wednesday keynote luncheon, during which Jordan P. Evans, Manager of the Mechanical Systems Division of NASA’s Jet Propulsion Laboratory will deliver the invited keynote talk on “Dare Mighty Things: Landing a Car on Mars”.

I’m also looking forward to the plenary session on Wednesday evening, Life after Moore’s Law, chaired by Rozalia Beica, of Dow Electronic Materials, featuring executives from the world’s leading research institutes including Subramanian Iyer, UCLA; Luc Van den hove, IMEC; Dim Lee Kwong, IME, Singapore; Liqiang Cao,NCAP, China; and Marie-Noelle Semeria, CEA-LETI. (Yes, you read that right, Rozalia Beica is now with Dow Electronic Materials, and she also happens to be chairing this session on her birthday, so be sure to wish her well if you attend the session.)

The SemiSister in me is thrilled to see that Qualcomm’s Beth Keyser has once again organized the CPMT Women’s Panel and reception, Maximize Your Career Potential, Wednesday, June 1, 2016 6:30-7:30 p.m. This year’s panel of influential women in the industry include Maryam Rofougaran, Seasoned Entrepreneur; Jan Vardaman,TechSearch International, Inc.; and Rebeca Jimenez, Amkor Technology, Inc. Last year’s event was a big hit and drew a significant crowd of men who didn’t want to miss out on some great advice on juggling career and family.

This year’s CPMT session on Thursday evening will address Systems, Devices, and Packaging Technologies for the IoT and Hyper-Connected Society. Georgia Tech’s Venky Sundaram chairs the session along with IBM’s Yasumitsu Orii. Speakers include Mudasir Ahmad, Cisco Systems, Inc; Kohji Hosokawa, IBM Corporation; Christian Hoffmann, TDK-Epcoa; and Eita Horiki; Sekisui America Corporation.

I can’t possibly list all of the technical talks focused on 3D, TSV, and advanced WLP including fan-out WLP: there are too many to count. I can direct you to the downloadable program so you can plan your attack. Alternatively, there’s an app for that.

Please be sure to stop by the 3D InCites table to say hello, update us on your progress with 3D and A-WLP technologies, talk about sponsorship on 3D InCites or to submit a nomination for the 2016 3D InCites Awards. ~ FvT

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