The people have spoken! The results of last week’s poll are in, and it looks like the majority of those who participated think we should keep it simple. When it comes to heterogeneous integration nomenclature for package architectures, it should be 2D or 3D. The Back Story The term “2.5D” has been a topic of debate in the advanced packaging world ever since it was first added to the industry... »
Yole Développement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth in revenue of +7% between 2016 and 2022. “Advanced packaging is showing a total revenue CAGR higher than the total packaging industry (3-4%), semiconductor industry (4-5%) and generally the global electronics industry (3-4%)”, comments Andrej Ivankovic, Technology & Mar... »
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is expanding production capacity at its corporate headquarters in St. Florian am Inn, Austria. Representing a 20 million Euro investment, the expansion will include the construction of a new building that provides additional production and te... »
It’s that time of year again! With SEMICON West just over 2 short months away, we’re ready to launch the 2017 3D InCites Awards. The 2017 3D InCites Awards will be presented on Wednesday, July 12, 2017, during SEMICON West, in a ceremony at the Impress Lounge, (located above Moscone North). The ceremony will be followed immediately by a cocktail reception to benefit this year’s designate... »
As each year passes, advanced packaging technologies offer more versatile solutions for cost-effective low-end applications, while 3D integration advancements continue to improve the performance of leading-edge products. This will be reflected at the 67th Annual Electronic Components and Technology Conference (ECTC), which takes place May 30, June 2, 2017, at the Walt Disney World Swan & Dolph... »
With the industry-wide shift in focus from furthering Moore’s Law to the realization that 3D integration and advanced packaging technologies are the shining stars of the next generation of electronics, the 66th Annual IEEE Electronic Components Technology Conference, which takes place May 31-June 3, 2016, at the Cosmopolitan of Las Vegas, promises to be one of the best ever. The agenda boasts 39... »
A little over a year ago, I wrote a Knowledge Portal entry about the cost of 3D ICs. Here I am again to tackle the issue of 2.5D and 3D cost reduction from a slightly different angle. This entry is based on what SavanSys presented at IMAPS Device Packaging 2016. The previous Knowledge Portal entry spent time discussing cost drivers; a few specific numbers were provided, but overall, the details we... »
This year’s keynote talks at the 2016 IMAPS Device Packaging Conference (DPC 2016) provided some new insight into a number of interesting areas of importance to the advanced packaging community. I already addressed Bill Chen’s talk, which focused on system-in-package (SiP) and introduced a 3D Fan-out SiP approach. Here, I’ll focus on the key take-aways from the other three keynote talks that... »
It’s been two years since I last visited EV Group headquarters in Schärding, Austria, so I was glad to be able attend EVG Technology Day on February 17, 2016 at the Fremont Marriott, in Fremont CA. It was a good reminder of the company’s many and varied capabilities in processes targeting 3D and MEMS, and I learned lots more about photonics and nano-imprint lithography (NIL). The first hal... »
Heterogeneous integration is in many ways different from other research technology platforms. For one thing, the technology is mostly driven by specific customer needs and hence extremely difficult to anticipate. For some applications, we need to build, on top of CMOS, various sensors, filters, fluidic channels or photonics circuits. For certain other applications, we sometimes even use exotic sub... »
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