Latest Posts - Page 2
Lam Research Advances Next Generation 3D Memory Manufacturing with Revolutionary New Etch Technology
Vantex™ redefines high aspect ratio etching with new innovations in technology and Equipment Intelligence® enabling chipmakers to progress 3D NAND...
Onto Innovation Announces New Inspection Platform for Leading-Edge Process Control and Device Reliability
Onto Innovation’s latest inspection advances have resulted in multiple orders from a top 3 OSAT and a top 3 image...Xperi Licenses DBI to Canon for CMOS Image Sensors
Direct Bond Interconnect (DBI®) hybrid bonding portfolio licensed to Canon to enhance image sensors in its industry-leading products SAN JOSE,...Lam Research Introduces Advanced Dielectric Gapfill Technology to Enable Next-Generation Devices
New Striker® FE enhanced atomic layer deposition platform addresses semiconductor manufacturing challenges for 3D NAND, DRAM, and Logic chipmakers FREMONT,...
ZEISS Adds Advanced Reconstruction Intelligence to 3D Non-destructive X-ray Imaging for Improved Semiconductor Package Failure Analysis
New iterative and deep learning reconstruction algorithms significantly enhance throughput and image quality for ZEISS Xradia Versa and Context microCT...
Xperi and Tower Semiconductor Announce New License for 3D Stacked Image Sensor Technology
Invensas direct and hybrid bonding technologies licensed by Tower Semiconductor to further enhance its outstanding pixel performance and significant competitive...
SkyWater Technology Foundry Selects Veeco’s WaferStorm for 3D Monolithic System-on-a-Chip Development
Veeco’s Best-in-Class Precision Surface Processing Platform Supports SkyWater’s Collaborative Work with Massachusetts Institute of Technology to Maximize Electronic Device Performance...HPC, AI and Datacenters: the 2.5D & 3D Stacking Technologies Playground
“2.5D and 3D stacking technologies are the only solution that meet the required performance of applications like AI[1] and datacenter...
What Should Replace “2.5D” in the Heterogeneous Integration Nomenclature?
The people have spoken! The results of last week’s poll are in, and it looks like the majority of those...
Advanced Packaging Adds Value and Reduces Cost for Future Semiconductor Products
Yole Développement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth in revenue of...
EV Group Expands Production Capacity at Corporate Headquarters in Austria
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
The 2017 3D InCites Awards Will Help Fund Kid Size Cures for Childhood Cancer
It’s that time of year again! With SEMICON West just over 2 short months away, we’re ready to launch the...
Meet Us at ECTC 2017 in Walt Disney World
As each year passes, advanced packaging technologies offer more versatile solutions for cost-effective low-end applications, while 3D integration advancements continue...
Meet Me at ECTC 2016 in Las Vegas
With the industry-wide shift in focus from furthering Moore’s Law to the realization that 3D integration and advanced packaging technologies...
Opportunities for 2.5D and 3D Cost Reduction
A little over a year ago, I wrote a Knowledge Portal entry about the cost of 3D ICs. Here I...
EMIB, the 3D Technology Landscape, and other Keynote Moments from IMAPS DPC 2016
This year’s keynote talks at the 2016 IMAPS Device Packaging Conference (DPC 2016) provided some new insight into a number...
EV Group Technology Day Examines Photonics, Nanoimprint Lithography, 3D and MEMS
It’s been two years since I last visited EV Group headquarters in Schärding, Austria, so I was glad to be able...
Combining Technology Platforms and Integrating Complex Materials for New Applications
Heterogeneous integration is in many ways different from other research technology platforms. For one thing, the technology is mostly driven...