ZEISS Process Control Solutions
ZEISS has the most comprehensive portfolio of light, X-ray, electron beam and ion beam imaging technologies in the industry and is a leading solution provider to the global semiconductor community. Solutions span semiconductor manufacturing from wafer fab through packaging and assembly. For mask making and lithography, ZEISS provides unique solutions in the areas of zero defect, in-die metrology, critical dimension/registration and overlay control. ZEISS innovative process control and failure analysis solutions deliver actionable information to both wafer fab and packaging/assembly processes to meet the semiconductor industry’s challenges for next-generation devices.
ZEISS is represented in over 40 countries around the globe with more than 40 manufacturing sites, around 50 sales and service locations, and over 20 research and development centers. Founded in 1846 in Jena, the company now has its headquarters in Oberkochen in southwest Germany. Carl Zeiss AG is wholly owned by the Carl Zeiss Stiftung (Carl Zeiss Foundation).