Latest Posts - Page 3
Executive Viewpoint: Inside a Multi-Project Wafer Program for 3D Integration
Multi-project wafer (MPW) programs have long been considered an economical way to integrate different IC designs from various teams to...
2015 Industry Outlook: SPTS Predicts its 3D Etch, PVD and CVD will reach HVM
In June 2014, SPTS co-produced a webinar with Ron Huemoeller of Amkor, titled “2.5D and 3D Packaging at the Tipping Point.”...
Executive Viewpoint: Invensas Opens its Toolbox of Interconnect Options
We’ve heard it expressed many times whenever there’s a new interconnect technology vying for adoption: manufacturers will select the best...
Moore’s Law and More Than Moore Are Laws Of Economics: 3D IC At The 25th Annual SEMI ASMC
Saratoga Springs, NY, rolled out the red carpet the week of 19 May 2014 for the 320+ attendees, speakers, panelists,... Triton Microtechnologies Receives Funding to Ramp Glass Interposer Manufacturing for 3D and 2.5D Semiconductor Packaging
Start-up Triton Microtechnologies, a designer and manufacturer of ultra-thin glass interposer technology that enables advanced semiconductor-packaging solutions, has met six-month... Dow Introduces SOLDERON Tin-Silver Plating Chemistry for Lead-Free Bumping
The company’s next-generation SnAg offers industry-leading plating rates and process flexibility for flip chip packages and interconnects. Dow Electronic Materials... EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System for Micro-and Nano-Electronics Production
Flexible System Integrates Spin/Spray Coating and Wet Processing for MEMS, Advanced Packaging and Compound Semiconductor Applications SEMICON SINGAPORE, May 7,...
More than Moore and 3D IC: Decoding the Code at the GSA Silicon Summit 2013
There’s probably no more fitting venue for discussing future directions for processing and packaging technology in integrated circuit fabrication than...IMAPS 2012 3D Tweeture Double Feature – Part 2
With two 3D focused keynotes and a 3D panel discussion, 3D Thursday was ripe for the tweeting. The sound bites...