NOMINATIONS HAVE BEEN EXTENDED TO WEDNESDAY, FEBRUARY 14, 2018. VOTING OPENS MONDAY, FEB 19, 2018.
Submit your nomination to recognize excellence in heterogeneous integration.
Nominations are open to all who would like to recognize a technology, individual, or company that has made a significant contribution to the advancement of the heterogeneous roadmap including 3D packaging, interposer integration, advanced fan-out wafer level packaging, MEMS and sensors, and full system integration. Winners will be chosen by industry peers, through an online voting process.
Nominations open January 8, 2018, and close February 12, 2018. Online voting opens February 14 and closes February 28 2018.
Winners will be announced at the 3D InCites Awards Ceremony, March 7, 2018 at the 2018 IMAPS Device Packaging Conference.
Nominations are now closed.
There is no fee for submitting a nomination, but we welcome donations in any amount to benefit Phoenix Children’s Hospital and IMAPS Foundations.