Garching, April 29, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has launched the Mask Aligner MA12 today.
This semi-automated tool is designed for industrial research and production of wafers up to 300mm and 300x300mm square substrates. It represents the latest mask aligner technology in terms of accuracy, optical performance and versatility. The operator-assisted MA12 offers highest process flexibility including submicron alignment and features the MO Exposure Optics of SUSS MicroTec, a unique illumination optics, adjustable to meet various exposure requirements.
The newly-introduced mask aligner addresses the Advanced Packaging market including 3D wafer-level chip scale packaging (3D WLCSP) and wafer-level packaging (WLP) as well as the MEMS market. The SUSS MicroTec MA 12 combines the advantages of a reliable manual tool specialized on the handling of delicate substrates, such as highly warped wafers and fragile substrates, with the performance of a state-of-the art 300mm lithography tool. Processes developed on the MA12 can be quickly transferred onto the automated SUSS MicroTec MA300 high volume production platform.
“The MA12 has been designed to enable quick and effective development of new products and process technologies”, explains Frank P. Averdung, president and CEO of SUSS MicroTec. “Research organizations will benefit from the enhanced capabilities of the industry-compatible MA12 as it offers the flexibility needed in the development and adoption of latest lithography processes.”