Garching, October 7, 2014 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, has launched its next-generation semi-automated permanent wafer bonder today. The SB6/8 Gen2 Wafer Bonder is SUSS MicroTec’s state-of-the-art universal permanent wafer bonding system that handles wafers up to 200 mm and supports various substrate types and sizes.
The tool allows for fully manual processing in research and development applications while at the same time providing the opportunity of an easy switch to volume production. It supports low force for adhesive bonding as well as high force for thermo compression or eutectic bonding and offers various chamber pressure conditions from vacuum to over pressure.
Flexible tooling allows for adapting to different requirements in the semiconductor industry. Major applications are in MEMS and LED packaging and production as well as 3D stacking.
The second tool generation provides an advanced heater and force control system as well as improved cooling rates. These new features lead to more precise control of the bonding processes.
Does SUSS supply such Bonding tools both to 2D & 3D (advanced packaging)
how do you handle the wafers (by EFEM , or stage..)?
Thanks
Lior