Adeia Inc. (Nasdaq: ADEA), the technology company known for developing foundational innovations that enable next-generation solutions for the semiconductor and media industries, today announced its participation at the IMAPS Device Packaging Conference (DPC) 2026, taking place March 2-5, 2026. At the event, Adeia will showcase two new technologies advancing AI hardware and advanced packaging, with a focus on hybrid bonding, thermal management, and system performance and reliability.
Attendees are invited to visit the Adeia booth to meet Tom Workman and Guilian Gao, along with Ron Zhang, Adeia’s thermal technology expert, to discuss the company’s latest technology developments addressing the performance, power density, and reliability challenges of AI-era computing.
“AI hardware innovation increasingly depends on how effectively advanced systems can be integrated, interconnected, and cooled,” said Laura Mirkarimi, SVP Head of Semi Engineering at Adeia. “Adeia’s foundational innovations in hybrid bonding and thermal technologies are enabling new levels of performance and reliability, and IMAPS DPC provides an important opportunity to engage with the ecosystem driving thSAN JOSE, Calif. — [Month Day], 2026 — Adeia Inc. (Nasdaq: ADEA), the technology company known for developing foundational innovations that enable next-generation solutions for the semiconductor and media industries, today announced its participation at the IMAPS Device Packaging Conference (DPC) 2026, taking place March 2-5, 2026. At the event, Adeia will showcase two new technologies advancing AI hardware and advanced packaging, with a focus on hybrid bonding, thermal management, and system performance and reliability.
Attendees are invited to visit the Adeia booth to meet Tom Workman and Guilian Gao, along with Ron Zhang, Adeia’s thermal technology expert, to discuss the company’s latest technology developments addressing the performance, power density, and reliability challenges of AI-era computing.
“AI hardware innovation increasingly depends on how effectively advanced systems can be integrated, interconnected, and cooled,” said Laura Mirkarimi, SVP Head of Semi Engineering at Adeia. “Adeia’s foundational innovations in hybrid bonding and thermal technologies are enabling new levels of performance and reliability, and IMAPS DPC provides an important opportunity to engage with the ecosystem driving the future of advanced packaging.”
Advancing Hybrid Bonding for Next-generation AI Systems
Adeia will highlight its latest hybrid bonding technology, which enables scalable 3D integration with enhanced interconnect density, speed, power efficiency, and long-term reliability. These capabilities are becoming increasingly critical as AI accelerators and heterogeneous architectures push beyond traditional packaging limits and place new demands on advanced interconnect solutions.
Addressing AI Thermal and Reliability Challenges
Adeia will also spotlight RapidCool™ direct-to-chip liquid cooling technology, an advanced thermal solution designed to address one of the most critical bottlenecks in AI infrastructure: thermal management at extreme power densities. RapidCool™ technology was recently recognized with Global Brands Magazine’s Excellence in Innovation award, underscoring Adeia’s leadership in next-generation cooling solutions for high-performance computing and AI systems.
Adeia’s participation at IMAPS DPC 2026 is part of a broader 2026 conference strategy focused on AI hardware, advanced packaging, and reliability. These themes will continue at ECTC in late May and later in the year at the IMAPS Thermal Conference in July, where Adeia will further highlight advances in thermal technologies, metrology, and reliability, including perspectives from Bongsub Lee on advanced measurement and validation for next-generation packaging environments.
Meet Adeia At IMAPS DPC 2026
Booth:#205
Event details: https://imaps.org/page/DPC_2026
About Adeia
Adeia is a leading R&D and intellectual property (IP) licensing company that accelerates the adoption of innovative technologies in the media and semiconductor industries. Adeia’s fundamental innovations underpin technology solutions that are shaping and elevating the future of digital entertainment and electronics. Adeia’s IP portfolios power the connected devices that touch the lives of millions of people around the world every day as they live, work and play. For more, please visit www.adeia.com.
Investor Relations
Chris Chaney
ir@adeia.com
Media Relations
Eric Thompson
press@adeia.com
