Packaging IFTLE

IFTLE 396: DARPA Envisions CHIPS as New Approach to Chip Design and Manufacturing

IFTLE 396: DARPA Envisions CHIPS as New Approach to Chip Design and Manufacturing

First a word on the change in venue… After working with Pete Singer at Solid State Technology from 2010-2018 and previously at Semiconductor International from 2007 – 2010 (as PFTLE), I have decided to move my packaging blog, IFTLE, to a new platform. I will be forever indebted to Pete for giving this old school technologist a chance to report on, and share his thoughts on, the world of IC pac... »

Dr. Phil Garrou Makes the Move to 3D InCites

Dr. Phil Garrou Makes the Move to 3D InCites

Yes. You read that right. It is my great pleasure to announce that Dr. Phil Garrou is joining 3D InCites as contributing editor and as a member of our esteemed technical advisory board. Like me, you may have noticed a pause in Phil’s missives on all things advanced packaging. While it’s only been a month or so since he penned his last post for Solid State Technology, it has already left a void... »

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