Packaging IFTLE

IFTLE 396: DARPA Envisions CHIPS as New Approach to Chip Design and Manufacturing

IFTLE 396: DARPA Envisions CHIPS as New Approach to Chip Design and Manufacturing

Phil Garrou October 17, 2018 Blogs, Packaging IFTLE 0

First a word on the change in venue… After working with Pete Singer at Solid State Technology from 2010-2018 and previously at Semiconductor International from 2007 – 2010 (as PFTLE), I have decided to move my packaging blog, IFTLE, to a new platform. I will be forever indebted to Pete for giving this old school technologist a chance to report on, and share his thoughts on, the world of IC pac... »

Dr. Phil Garrou Makes the Move to 3D InCites

Dr. Phil Garrou Makes the Move to 3D InCites

Francoise von Trapp October 8, 2018 Blogs, Francoise in 3D, Packaging IFTLE 0

Yes. You read that right. It is my great pleasure to announce that Dr. Phil Garrou is joining 3D InCites as contributing editor and as a member of our esteemed technical advisory board. Like me, you may have noticed a pause in Phil’s missives on all things advanced packaging. While it’s only been a month or so since he penned his last post for Solid State Technology, it has already left a void... »

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