IFTLE 474: EPTC 2020 Highlights; TSMC Packaging in Japan
Jan 19, 2021 · By Phil Garrou · Blogs, Packaging IFTLE
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IFTLE 427: TSMC’s Next-Gen 3D Technology – N3XT
Continuing our look out into the future, at the recent Hot Chips Conference, Dr. Phil Wong, VP of R&D at TSMC...
IFTLE 426: Exascale Computing is Near; Incandescent Lightbulbs get a Reprieve
Earlier this year, John Shalf, department head of Computer Science at Lawrence Berkeley National Labs (LBNL) presented a plenary presentation...
IFTLE 425: Deca FOWLP is Going Mainstream; Highlights from Hot Chips
Deca Technologies has confirmed that its M-Series™ fan-out wafer-level packaging (FOWLP) technology has been adopted by Qualcomm for power management...
IFTLE 424: Fingerprint Sensors Are Going Ultrasonic
IIFTLE is always on the lookout for technologies that will require advanced packaging solutions. Fingerprint sensors for today’s latest smartphones...
IFTLE 423: GLOBALFOUNDRIES and ARM Turn to 3D Chip Stacks for High Performance Computing
It was exactly a year ago that GLOBALFOUNDRIES’ announced that they would no longer be competing in the node scaling...
IFTLE 422: Is Advanced Packaging Production Returning to the US by SHIP?
Is advanced packaging production coming back to the USA? The Navy (i.e. NSWC Crane) is currently seeking proposals from the...
IFTLE 421: Intel Showcases Co-EMIB Advanced Packaging Architecture
Building on their previous announcements of its embedded interconnect bridge, EMIB, ( see IFTLE 324 “Intel EMIB Implementation in the...IFTLE 420: Low-Loss NCF and Laser-Assisted TCB
Since it first appeared several years ago, IFTLE has been a big-time proponent of pre-applied non-conductive film (NCF) combined with...
IFTLE 419: Update on GlobalFoundries Foundry Status and Cree’s SiC Plans
Is GlobalFoundries looking for an exit or simply shedding parts of the company that do not fit its new focus?...
IFTLE 418: Xperi DBI Ultra for D2W Hybrid Bonding
Requirements for interconnect pitches of 20µm and below is expected to be the norm in the future. Since typical solder...
IFTLE 417: Passing the Advanced Packaging Baton to TSMC and its 3D-MiM
As IFTLE has been predicting for many years, the baton is once again being passed. In the early days of...
IFTLE 416: What’s Coming Next on the IC Front End? Samsung Gates All Around
IFTLE has been saying for a few years that the decades-long scenario of moving from one node to the next...
IFTLE 415: Substrate-like PCBs; Three Top Ten Packaging Houses are China-based
Substrate-like PCBs (SLP) is a term describing a high-density printed circuit board (PCB) that has feature sizes close to that...
IFTLE 414: Lester the Lightbulb… Revisited
In the past few weeks, a reader sent a message to IFTLE titled “Time to bring back Lester the Lightbulb”...
IFTLE 413: Beware of Technology Hype for the Automotive Market
As packaging practitioners/experts themselves, regular readers know that IFTLE is always on the lookout for the latest applications and the...
ITFLE 412: Samsung Discusses Packaging for the 4th Industrial Revolution; Yole looks at Non-TSV Options
At the recent IMAPS Device Packaging Conference in Fountain Hills, AZ. Kyung Suk (Dan) Oh, Package Development VP at Samsung,...
IFTLE 411: Focus on the Sensor Technology Market
At the recent IMAPS Device Packaging Conference, March 5-7, 2019 in Fountain Hills AZ, Benedetto Vigna, president of the ST...
IFTLE 410: ST Microelectronics Bets on SiC; A Look at Power Device Packaging
Silicon Carbide (SiC) is a wide bandgap (WBG) material that has advantages when compared to silicon (Figure 1). For the...
IFTLE 409: ST Micro Studies Hybrid Bonding Reliability; TSMC 2019 Packaging Revenue
Continuing our look at the 2019 SEMI 3D and Systems summit in Dresden, we look at presentations on advanced packaging...