Design View all

Making Progress with 3D IC Design and Test

Thank you, Ann Steffora Mutschler (Semiconductor Engineering) for getting to the bottom of the difference of EDA tools for  2.5D and 3D IC design and test, and providing such a clear explanation in your post, “Evolution vs. Revolution”. In this 2-part post, Mutschler explores the EDA vendor arguments that “tool...

3D IC Design: Outlook for 2014

To date we at Mentor Graphics have seen a handful of 3D IC design releases, and even more customer evaluations. However, the predominant driver seems to be a desire to understand the space in case their company elects to move into the space. In general, the perception seems to be...

2.5D Interposer Innovations from Silex and eSilicon

2.5D interposers sparked a good amount of discussion at this year’s 3D ASIP conference (December 11-13, 2013, Burlingame CA), with a session devoted to “Interposers for all of Us” and other presentations scattered throughout the program to address such issues as thin wafer handling, and heterogeneous integration. Weighing in on...

Devices View all

SORIN CRM: 3D IC Module for Active Medical Implant

Manufacturing of 3D IC heterogeneous integrated modules for the electronics of a leadless pacemaker in a very small volume has been realized. Manufacturing of 3D IC modules using the described process is ready for medium volume production. Testimonial All the electronics of a leadless pacemaker has been integrated into a...

Schiltron 3D Flash

Schiltron 3D Flash replaces 2D-NAND. It uses a unique architecture solving key challenges associated with other 3D-NAND approaches: scalable; no vanishing string currents; uses existing Fab infrastructure and materials; uses existing design approaches for program and erase; endurance of over a million cycles; post-cycling retention of more than 10 years...

Novati Technologies: Silicon Interposer Module

The 2.5D Interposer Module features three front-side interconnect layers of dual-damascene copper on top of a single-damascene copper metal layer, with 2µm Line/Space/Thickness interconnect dimensions. The via-first TSVs are copper-filled with a 10:1 aspect ratio and via-last TSVs are copper-lined, polyimide-filled with a 5:1 aspect ratio, both with 50µm pitch....

3D NAND Flash – Schiltron’s Answer

It probably appears that the only 3D technologies vying for 2D NAND’s crown are V-NAND from Samsung and p-BiCS from Toshiba/SanDisk, with their key selling point being their ability to use few lithography steps to build 3D stacked memory. For background, see Jim Handy’s series and mine. Here I will...

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