Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough
Apr 16, 2026 · By Remtec, Inc. · 3D In-Depth, Applications
Design View all
Engineering Copper Grain Structure for High-Yield Hybrid Bonding in 3D Packaging
Why copper grain size matters for hybrid bonding and how to control it for HBM and chiplets. Read the article here. Abstract Hybrid bonding is reshaping advanced packaging by enabling ultra-fine pitch copper-to-copper interconnects, essential for high-bandwidth memory (HBM), chiplet integration, and 3D heterogeneous systems. While alignment precision, oxide control,...
The Next Mode of Transformation: 3D IC Integration
The semiconductor industry finds itself at a critical juncture, where the traditional paradigms of Moore’s Law are encountering fundamental physical and economic limitations. As the industry grapples with the imperative to sustain innovation and meet the escalating performance demands of contemporary computing applications, the transition to 3D IC design emerges...
Devices View all
How AiP Technology Helps Enable 5G and More
For 5G smartphones and other millimeter-wave (mmWave) applications, antenna integration, either through antenna-in-package (AiP) or antenna-on-package (AoP) technologies, simplifies the challenges associated with designing products that operate at these high frequencies. A variety of AiP/AoP design methodologies provide the required form, fit, and function for these applications and can include...
System-on-Chip Disintegration is Underway
We have known for some time that with scaling coming to an end the industry would need to find another way to continue moving forward. One of the options is known as SoC disintegration, which is when a system-on-chip (SoC) is disintegrated into its functional parts and then connect these...
Latest Posts - Page 4
Wafer Bonding and NanoCleave: The New Lithography Scaling
NanoCleave enables Laser Debonding on Silicon with Nanometer Precision In semiconductor manufacturing, 3D integration – the manufacturing, vertical assembly, and...
Sustainability 101: What Good Are Awards?
Awards and rewards can motivate behavior. An obvious example is online gaming, where players earn stars, points, or access to...
Interconnect Reliability: From the Chip to the System
Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle...
SiC MOSFET Challenges, Demand and Industrialization of Test & Burn-in
The coming-of-age and breakthroughs offered by silicon carbide (SiC) MOSFETs, as well as demand that is outstripping supply are rapidly...
Forging a New Future for 3D IC Design and Architecture
The semiconductor industry’s ability to coax more and more performance out of a chip has produced the most significant innovations...
Update on the UCIe™ from ITC 2022
In 1965 Gordon Moore proclaimed that there would be a “’Day of Reckoning’ when it may prove to be more...
Chiplet Designs and Heterogeneous Integration Packaging
System-on-Chip (SoC) integrates ICs (by reducing the feature size) with different functions such as central processing unit (CPU ), graphic...
Materials Science Solutions for Electronics Sustainability
This summer, the temperature reached 111°F in Silicon Valley, where I live. This historical record unmistakably brought home the “inconvenient...
Thermal Analysis Techniques to Improve High Density Semiconductor System Performance
Thermal problems in semiconductor electronic systems often go unnoticed and cause failures. Although thermal problems can be understood and avoided...
Maskless Lithography Addresses Shift Toward Heterogeneous Integration and 3D Packaging
Moving from 2D scaling to heterogeneous integration and 3D packaging is ever-more critical to improving semiconductor device performance. In recent...
Development of Innovative Advanced Packaging Materials for System in Package
Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous integration. Different assembly processes are...
Understanding Wafer Applications in Surface Metrology
This detailed blog covers how wafers are manufactured and processed, what makes a perfect wafer, and which surface metrology approaches...
Contributing to a Greener Semiconductor Industry
Recently we read an interesting article here on 3D InCites about the role secondary markets play in contributing to a...
Considerations in Power Amplifier Package Design
Understanding the role of compromises and trade-offs in the design process Electronic packages serve many purposes including protecting, connecting, and...
Design-for-test for 3D IC Designs Comes of Age
In the era of more-than-Moore, 3D IC is the new scaling approach adopted by the marketplace. Progress has been made...
Advanced Packaging – Measuring Deep Etch Trenches
Adoption of advanced packaging is accelerating as the benefit of the classic Moore’s Law transistor shrink diminishes on a monolithic...
Metrology in Advanced Packaging
With the dawn of chiplet integration, advanced chip manufacturing and advanced packaging technologies are more complex than ever. Dies are...
Adaptive Control: The “Holy Grail” in Semiconductor Smart Manufacturing
Artificial intelligence and machine learning (AI/ML) can have various applications in smart manufacturing for semiconductor fab, advanced packaging, and electronics...
Electronics Packaging – From Afterthought to Product Differentiator
Electronics Packaging vs. Advanced Packaging Electronics packaging is generally divided into three major areas, traditional packaging – also called standard...
