Casey Krawiec is Vice President of Global Sales for StratEdge Corporation. He has worked for companies involved with wafer preparation, microelectronic assembly, and packaging for over 25 years. After earning a BS in Mechanical Engineering from the University of Kentucky and an MBA from the University of Louisville, Casey was a design engineer for the Department of Defense for several years. He began his career in microelectronics at Kyocera, worked for 6 1/2 years at StratEdge, and most recently, was director of sales and marketing at Quik-Pak before returning to StratEdge.
StratEdge has been designing and manufacturing packages for high-power, high-frequency compound semiconductors since the early 1990s, with much attention focused...
Understanding the role of compromises and trade-offs in the design process Electronic packages serve many purposes including protecting, connecting, and...
