3D In-Depth

3D ASIP Returns Under The IMAPS Umbrella for Its 13th Edition

3D ASIP Returns Under The IMAPS Umbrella for Its 13th Edition

In less than two weeks, the 13th Annual Architectures for Semiconductor Integration and Packaging Conference (3D ASIP) kicks off at the Marriott San Francisco Airport, this year under the auspices of the International Microelectronics and Packaging Society (IMAPS). Long heralded as THE conference for 2.5D and 3D integration, the conference was created by the Tech Venture Forum at RTI International... »

What’s New for the 2017 European 3D Summit

What’s New for the 2017 European 3D Summit

For the fifth consecutive year, the European 3D Summit returns to Grenoble, January 23-25, 2017. The event has evolved over those years, beginning its tenure as the 3D TSV Summit, then last year re-branded as the 3D Summit in acknowledgment that not everything in 3D has to do with through silicon vias (TSVs). I’ve been honored to attend the four previous years, and have found the event to consis... »

MEMS & Sensors Executive Congress 2016 Sets Out to Conquer the Internet of Countless Things

MEMS & Sensors Executive Congress 2016 Sets Out to Conquer the Internet of Countless Things

A shift has occurred. As MEMS becomes mainstream, the focus of the annual MEMS & Sensors Executive Congress (MEC 2016) was less on MEMS development and more about the fun part: how we put these technologies to work for us. As Stefan Finkbeiner, Bosch Sensor Systems so eloquently put it, “Nobody wants to buy an accelerometer anymore, they want a step counter.” So how do we capture the value... »

IWLPC 2016 Keynotes Look to A Connected Future Enabled by Advanced Packaging

IWLPC 2016 Keynotes Look to A Connected Future Enabled by Advanced Packaging

The 2016 International Wafer-Level Packaging Conference (IWLPC), which took place October 18-20, 2016 in San Jose, CA, focused on a theme of “Bridging the Interconnect Gap”, as the industry faces new challenges due to the onslaught of Big Data brought about by the Internet of Things (IoT). To provide vision on how best to address these challenges using advanced packaging technologies, the IWLP... »

MEMS & Sensors Industry Group Reveals Tech Showcase Finalists

MEMS & Sensors Industry Group Reveals Tech Showcase Finalists

MEMS & Sensors Industry Group (MSIG)’s annual MEMS & Sensors Technology Showcase at MEMS & Sensors Executive Congress® 2016 (November 9-11, 2016 in Scottsdale, AZ) highlights some of the newest and most unique MEMS/sensors-enabled applications in the industry. MSIG today announced the shortlist of finalists who will compete for the title of “winner” at this year’s even... »

Top Ten Reasons to Attend the 2016 European MEMS Summit

Top Ten Reasons to Attend the 2016 European MEMS Summit

Ok everybody, here it is, back by popular demand: the TOP TEN reasons (this time told in photos) why you don’t want to miss the second annual European MEMS Summit, which takes place September 15-16, 2016 at the Maritim Hotel Stuttgart Germany: 10: You get to mix and mingle with key decision makers at the industry’s largest MEMS and sensor business and technology conference. 9: You’ll... »

SEMICON Europa Advanced Packaging Conference Looks at Consumer and Harsh Environment Packaging

SEMICON Europa Advanced Packaging Conference Looks at Consumer and Harsh Environment Packaging

System integration is moving forward.  Denser and high performing systems require advanced packaging, assembly, and test players to move closer together, and they mandatorily need to be involved in the collaboration along the full supply and value chain from the early beginning of new projects. The package is becoming a functional part of the product and with it a differentiator for the product... »

Leading Market Analysts to Explore Future of MEMS at the European MEMS Summit

Leading Market Analysts to Explore Future of MEMS at the European MEMS Summit

The second annual European MEMS Summit takes place in Stuttgart, Germany, on September 15-16, 2016. In addition to top MEMS technologists, the summit will feature numerous market experts to speak about cost models, business strategies, and market outlooks. Here’s a sneak peek at the Market and Business line-up: Jeremie Bouchaud Sensors for IoT: How Big is the Market Going to Be? Jeremie Bo... »

Heterogeneous Integration enabled by Advanced Packaging Leads the Way at SEMICON West 2016

Heterogeneous Integration enabled by Advanced Packaging Leads the Way at SEMICON West 2016

I have to admit, after attending this week’s SEMICON West 2016, I’m feeling a little smug. Why? Because after years of waiting in the shadows for its day in the sun, advanced packaging is finally getting its turn, thanks to the push towards heterogeneous integration, which relies on advanced packaging technologies to integrate a multitude of disparate technologies including MEMS and sensors, l... »

3D InCites Guide to SEMICON WEST 2016

3D InCites Guide to SEMICON WEST 2016

In past years, we have provided 3D InCites readers with a guide for navigating through the myriad programs that specifically address 3D integration and packaging at SEMICON West. This year, as SEMI has discovered, everything has changed; and thus they themed SEMICON West 2016, “Definitely NOT business a usual.” As an industry, we have moved far beyond the point of industry segments working... »

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