SPM Wafer Cleaning for Advanced Semiconductor Manufacturing
Jun 23, 2026 · By ACM Research · 3D In-Depth, Manufacturing
Design View all
SWAP Hub earns DoW Year 2 Award Investment from NSTXL
The Microelectronics Commons NSTXL (National Security Technology Accelerator) has announced the DoW Year 2 awards, with more than $200M invested across 26 projects nationwide and the Southwest Advanced Prototyping (SWAP) Hub earning continued support for multiple high-impact efforts already advancing U.S. microelectronics innovation. These awards recognize real progress and growing...
Engineering Copper Grain Structure for High-Yield Hybrid Bonding in 3D Packaging
Why copper grain size matters for hybrid bonding and how to control it for HBM and chiplets. Read the article here. Abstract Hybrid bonding is reshaping advanced packaging by enabling ultra-fine pitch copper-to-copper interconnects, essential for high-bandwidth memory (HBM), chiplet integration, and 3D heterogeneous systems. While alignment precision, oxide control,...
Devices View all
How Implantable Brain-Computer Interfaces Are Pushing the Boundaries of Precision Die Bonding
A patient who can no longer speak generates text directly from neural activity. A patient with paralysis controls a cursor using thought alone. Behind demonstrations like these is a difficult engineering problem: how do you assemble electronics delicate enough to interact with the human brain, while keeping them stable inside...
Navy’s Directed Energy Systems Integration Lab to Train Sailors on Laser Weapons
By Thomas McMahon Naval Surface Warfare Center, Port Hueneme Division, CA Sailors can now get certified in operating and maintaining the fleet’s most prevalent directed energy system through a new training program at Naval Surface Warfare Center, Port Hueneme Division (NSWC PHD)’s Directed Energy Systems Integration Laboratory (DESIL), with the first...
Latest Posts - Page 5
Materials Science Solutions for Electronics Sustainability
This summer, the temperature reached 111°F in Silicon Valley, where I live. This historical record unmistakably brought home the “inconvenient...
Thermal Analysis Techniques to Improve High Density Semiconductor System Performance
Thermal problems in semiconductor electronic systems often go unnoticed and cause failures. Although thermal problems can be understood and avoided...
Maskless Lithography Addresses Shift Toward Heterogeneous Integration and 3D Packaging
Moving from 2D scaling to heterogeneous integration and 3D packaging is ever-more critical to improving semiconductor device performance. In recent...
Development of Innovative Advanced Packaging Materials for System in Package
Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous integration. Different assembly processes are...
Understanding Wafer Applications in Surface Metrology
This detailed blog covers how wafers are manufactured and processed, what makes a perfect wafer, and which surface metrology approaches...
Contributing to a Greener Semiconductor Industry
Recently we read an interesting article here on 3D InCites about the role secondary markets play in contributing to a...
Considerations in Power Amplifier Package Design
Understanding the role of compromises and trade-offs in the design process Electronic packages serve many purposes including protecting, connecting, and...
Design-for-test for 3D IC Designs Comes of Age
In the era of more-than-Moore, 3D IC is the new scaling approach adopted by the marketplace. Progress has been made...
Advanced Packaging – Measuring Deep Etch Trenches
Adoption of advanced packaging is accelerating as the benefit of the classic Moore’s Law transistor shrink diminishes on a monolithic...
Metrology in Advanced Packaging
With the dawn of chiplet integration, advanced chip manufacturing and advanced packaging technologies are more complex than ever. Dies are...
Adaptive Control: The “Holy Grail” in Semiconductor Smart Manufacturing
Artificial intelligence and machine learning (AI/ML) can have various applications in smart manufacturing for semiconductor fab, advanced packaging, and electronics...
Electronics Packaging – From Afterthought to Product Differentiator
Electronics Packaging vs. Advanced Packaging Electronics packaging is generally divided into three major areas, traditional packaging – also called standard...
Maximize Large Volume Failure Analysis Throughput with Parallel Processing of Laser Ablation and Plasma FIB
Determining the causes of failures in semiconductors often requires removing overlying material to expose the failed circuit element for high-resolution...
ML/AI in Semiconductor Packaging and Electronics Manufacturing
As the semiconductor packaging technology evolves in the “More than Moore” era, many advanced processes have presented challenges in manufacturing....
Autonomous Vehicles Drive AI Advances for Edge Computing
Advances in Edge Computing Must Innovate for Autonomous Vehicles to Realize Their Potential Large numbers of sensors, massive amounts of...
Artifact-free Decapsulation of 2.5D and 3D Advanced Packages
As semiconductor devices are subject to increasingly higher quality and reliability standards, extensive measures must be taken to ensure these...
Hybrid Bonding Bridges the Technology Gap
A Technology Chasm Until recently, the world of IC fabrication was neatly divided into the distinct stages of front-end and...
Will An Adhesion Promoter Prevent Delamination in Power Semiconductor Packages?
Power semiconductor packages are used in high temperature, high voltage environments. With the increase of electric vehicles (EVs) and hybrid...
Die-to-Wafer Bonding Steps into the Spotlight on a Heterogeneous Integration Stage
The semiconductor industry is currently undergoing the most radical change in its history. Many new applications such as artificial intelligence...