A Legacy of Innovation: Celebrating 50 Years of VIEW Micro Metrology
Aug 07, 2026 · By VIEW Micro Metrology · 3D In-Depth, Design, Processes and Technology, Test and Inspection
Design View all
Siemens advances self-verifying agentic AI workflows for semiconductor and PCB design
Combines Siemens’ EDA expertise and software with NVIDIA AI infrastructure and software to improve result quality, time-to-results, tool-calling reliability and token efficiency for long-running engineering workloads Enables agentic AI workflows that help engineers improve productivity and design quality across the electronic design automation (EDA) lifecycle Delivers more predictable, trusted outcomes...
SPM Wafer Cleaning for Advanced Semiconductor Manufacturing
Wafer cleaning is one of the most critical steps in the semiconductor process flow, especially as dimensions continue to shrink to below the 1-nanometer (nm) node. Photoresist residue and particulates can reduce yields in large-die AI chips, impacting the performance of the final product or causing the chips to be scrapped. The sulfuric acid hydrogen peroxide step, or sulfuric peroxide mixture (SPM), is essential for removing organic contaminants from post-etch substrates and ion-implanted films, as well as for platinum silicide residue...
Devices View all
How Implantable Brain-Computer Interfaces Are Pushing the Boundaries of Precision Die Bonding
A patient who can no longer speak generates text directly from neural activity. A patient with paralysis controls a cursor using thought alone. Behind demonstrations like these is a difficult engineering problem: how do you assemble electronics delicate enough to interact with the human brain, while keeping them stable inside...
Navy’s Directed Energy Systems Integration Lab to Train Sailors on Laser Weapons
By Thomas McMahon Naval Surface Warfare Center, Port Hueneme Division, CA Sailors can now get certified in operating and maintaining the fleet’s most prevalent directed energy system through a new training program at Naval Surface Warfare Center, Port Hueneme Division (NSWC PHD)’s Directed Energy Systems Integration Laboratory (DESIL), with the first...
Latest Posts - Page 5
The Rise of Organic and Glass Substrates
If you are designing a heterogeneously integrated, multi-die, high-performance device for markets such as HPC, AI, data centers, etc., then...Hybrid Bonding takes Heterogeneous Integration to the Next Level
Hybrid bonding enables an assortment of possible chip architectures, mainly targeted at high-end applications including high-performance computing (HPC), artificial intelligence...
A Look at the Next Generation of Packaging Inspection Solutions
With the increasing expectations and demands of customers of electronic equipment, the manufacturing technologies applied are also propelled due to...
Heterogeneous IC Packaging: Building an Infrastructure
Heterogeneous IC packaging is here. It is already in production, and increasingly more customers are developing and qualifying their products...
Excitement Over Chiplets: Not for Everyone and Not Trivial for Test
Live from “Silicon Desert”: The news is all about huge spending by TSMC and Intel. Investment in advanced packaging (2.3/2.5/3D...
Digital and Physical: Thermal Twins for Developing Thermal Management Solutions
As we all know, finding thermal management solutions is becoming an increasingly critical but also an ever more challenging issue...
Updates in Test Connectivity System (TCS) from TestConX
The annual TestConX conference (www.testconx.org) was held March 5-8, 2023, in Mesa, Arizona. It offered a one-of-a-kind, one-stop shop for...
Wafer Bonding and NanoCleave: The New Lithography Scaling
NanoCleave enables Laser Debonding on Silicon with Nanometer Precision In semiconductor manufacturing, 3D integration – the manufacturing, vertical assembly, and...
Sustainability 101: What Good Are Awards?
Awards and rewards can motivate behavior. An obvious example is online gaming, where players earn stars, points, or access to...
Interconnect Reliability: From the Chip to the System
Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle...
SiC MOSFET Challenges, Demand and Industrialization of Test & Burn-in
The coming-of-age and breakthroughs offered by silicon carbide (SiC) MOSFETs, as well as demand that is outstripping supply are rapidly...
Forging a New Future for 3D IC Design and Architecture
The semiconductor industry’s ability to coax more and more performance out of a chip has produced the most significant innovations...
Update on the UCIe™ from ITC 2022
In 1965 Gordon Moore proclaimed that there would be a “’Day of Reckoning’ when it may prove to be more...
Chiplet Designs and Heterogeneous Integration Packaging
System-on-Chip (SoC) integrates ICs (by reducing the feature size) with different functions such as central processing unit (CPU ), graphic...
Materials Science Solutions for Electronics Sustainability
This summer, the temperature reached 111°F in Silicon Valley, where I live. This historical record unmistakably brought home the “inconvenient...
Thermal Analysis Techniques to Improve High Density Semiconductor System Performance
Thermal problems in semiconductor electronic systems often go unnoticed and cause failures. Although thermal problems can be understood and avoided...
Maskless Lithography Addresses Shift Toward Heterogeneous Integration and 3D Packaging
Moving from 2D scaling to heterogeneous integration and 3D packaging is ever-more critical to improving semiconductor device performance. In recent...
Development of Innovative Advanced Packaging Materials for System in Package
Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous integration. Different assembly processes are...
Understanding Wafer Applications in Surface Metrology
This detailed blog covers how wafers are manufactured and processed, what makes a perfect wafer, and which surface metrology approaches...