Design View all

Apache Design: RedHawk-3DX

Product Description Apache Design’s fourth-generation RedHawk™-3DX simulation software technology extends previous generations’ capabilities to address sub-20 nanometer (nm) designs with 3+ gigahertz performance and billions of gates. It is also architected to support the simulation of emerging chip and packaging technologies using multi-die three-dimensional ICs (3D-ICs) for smart electronic products....

Mentor Graphics: Calibre

Product Description Calibre enables signoff verification of chip stacks with flip chips, silicon interposers and through-silicon vias (TSVs). Verification of individual dies is followed by checks on the interfaces between dies, including dimensional checks (bump alignment and rotation), connectivity checks (LVS), and parasitic extraction (PEX) using a special 3D-IC rule...

ALLVIA: Silicon Interposers for Electro-Optical Engines

Product Description 2.5D Silicon Interposers form the base for the assembly of electro-optic engines for Chip-to-World Interconnects. These electro-optic engines with TSVs, the foundation for so-called “active cables”, offer outstanding Interconnect Bandwidth Density. They operate at 10 Gb/s today and are expected to migrate to 25 Gb/s or higher in...

E-System Design: Sphinx 3D Path Finder

Product Description 3DPF is a full wave 3D path finding tool based on a patented, mesh-less algorithm for cylindrical objects (vias and bond wires).  By not meshing cylindrical objects, significant memory and CPU time is saved allowing users to analyze much larger structures in a much shorter time. Testimonial From Sherry...

Devices View all

Technology Updates at ECTC 2013

The ECTC 2013 stats are in. This year showed increases across the board with: Over 1,300 attendees, the highest attendance ever, from 26 countries 377 technical papers, presented in 36 oral and five interactive presentation sessions, including a student poster session 12 sessions focused on 3D/TSV, including several of the...
MonolithIC 3D's PDN concept f removing heat from 3D ICs.

Tying up 2012 3D IC Loose Ends

I don’t know about you, but I always find that amidst the holiday hubbub, the really important stuff gets shoved aside and falls through the cracks. Just in case you missed them, here are some good 3D related posts that may have been lost in the December race to “get...

Latest Posts - Page 7

KLA-Tencor: CIRCL-AP™

CIRCL-AP™ is a cluster tool with multiple modules, covering all-surface inspection, metrology and review at high throughput for efficient advanced...

Amkor: SLIM

Amkor’s SLIM (siliconless integrated module) is a dies-last package technology providing the thinnest possible form factor with the highest level...